Supermicro SuperServer SYS-112B-WR Bedienungsanleitung
Supermicro
Server
SuperServer SYS-112B-WR
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JNVME2
DESIGNED IN USA
SAN MAC
MAC CODE
REV:1.01
X14SBW-TF
IPMI CODE
BIOS LICENSE
BAR CODE
JSXB1A
JUIDB1
LED6
LAN1 LAN2
LEDBMC JNCSI
BMC_LAN
USB0/1 (3.0)
COM1
MH2
JPL3
JPL2
JPL1
JMP1
JMP2
COM2
LED4
JM2_1 JM2_2
LED7
MH13
MH12
MH10
MH11
JDB2
JPRG1
JPFR3
JPFR2
JDB3
JPT1
JBT1
BT1
JSXB2: PCIe 5.0 p1-x8 (in x16)
JSXB1B: PCIe 5.0 p1-x16 + x16
USB2/3
JF1
LEDPWR
JNVME4
JT MED
MH1
VGA
JTPM1
JVRM1
JVRM2
JSYSID2
JSYSID1
JNVME1
MH8
JPI2C1
JRK1
JSTBY1
JDB1
JPWR3
JPWR1 JPWR2
MH7
FAN1FAN2
FAN3
MH5
FAN4
FAN5
FAN6
JL1
JNVME3
JIPMB1
MH9
JBPNI2C1JSEN1
JNVI2C1
SATA0–7
JSXB1C
MH6
MH15
DIMME1
DIMMF1
DIMMG1
DIMMH1
DIMMD1
DIMMC1
DIMMB1
DIMMA1
http://www.supermicro.com MNL-2688-QRG Rev. 1.0
SuperServer 112B-WR Quick Reference Guide
Caution
Board Layout Rear View and FeaturesFront View and Features
BMC Password Label
Memory
CPU Installation, supporting a single Intel® Xeon® 6 Processor (LGA 4710)
1 2
6
7
5
8
3
For mo fo : re in rmation go to
ht :tp //www. up o.s erm cri com/s rtuppo
PRODUCT RESOURCES:
B. Assembling the Processor Heatsink Module (PHM)
1. If this is a new heatsink, the thermal grease has been preapplied. Otherwise, apply the proper
amount of thermal grease.
2. Hold the processor carrier assembly so the processor's gold contacts are facing up, then align
the holes of the processor carrier assembly with the holes on the heatsink. Press the processor
carrier assembly down until it snaps into place. The plastic clips of the processor carrier assembly
will lock at the four corners.
3. Examine all corners to ensure that the plastic clips on the processor carrier assembly are firmly
attached to the heatsink.
Pin 1
a
c
b
d
A
C
B
D
A. Creating the Intel Xeon 6 CPU Carrier Assembly
1. Locate small gold triangle (Pin 1) on processor and corresponding
hollowed triangle on carrier.
2. Using the triangles as a guide, carefully align and place Point A of
the processor into the carrier. Gently snap into place to fasten onto
Point B.
Pin 1
Make sure the lever
is pressed down before
installing the processor.
A
B
Processor Carrier Assembly
(Upside Down)
Check each corner to ensure that the processor carrier is firmly attached to the heatsink.
Triangle on the
processor carrier
Triangle on the CPU
Thermal grease
C. Preparing the CPU Socket for Installation
Gently pull off the plastic protective cover by one corner to
remove it from the CPU socket.
D. Installing the Process Heatsink Module
1. Locate four threaded fasteners (a, b, c, d) on the CPU socket. 3. Press all four rotating wires outward to latch the PHM
onto the CPU socket.
4. With a t30-bit screwdriver, tighten all PEEK nuts in the
sequence of A, B, C, and D with even pressure not greater
than 8 in-lbf (0.904 N-m).
A, B, C, D: Peek Nut
1, 2, 3, 4: Rotating Wire
a, b, c, d: Threaded Fastener
Peek Nut
(Unlatched) (Latched)
Rotating Wire
a
c
b
d
C
A
D
B
Rotating Wire 1
Rotating Wire 3
Rotating Wire 4
Rotating Wire 2
Peek Nut
Gr absip T
a
b
c
d
(a, b, c, d: Threaded Fasteners) CPU Socket Pin1
Threaded
F enerast
CPU etSock
Rotating
Wire
Rotating
Wire
2. Locate four PEEK nuts (A, B, C, D) and four rotating wires (1, 2, 3, 4) on the heatsink as
shown below. Gently place the heatsink on the CPU socket, making sure that each nut is
properly aligned with its corresponding threaded fastener.
A
B
C
D
CAUTION:
Always be sure all power supplies for this
system have the same power output.
If mixed power supplies are installed,
the systemwill not operate.
IMPORTANT: See installation instructions
and safety warning before connecting
system to power supply.
http://www.supermicro.com/about/policies/
safety_information.cfm
SAFETY INFORMATION:
To reduce risk of electric shock/damage to
equipment, disconnect power from server by
disconnecting all power cords from electrical
outlets. If any CPU socket empty, install
protective plastic CPU cap.
WARNING:
CAUTION:
This unit has redundant power sources.
Please disconnect all the power
cords before servicing.
4
9
10
11
12
13
16
14
17
15
21
20
19
18
Item t nDescrip io
1 t P S sRedundan ower upply Module
2 S P terial or
3 t B LAN P tDedica ed MC or
4 Two en1 or U 3.2 GSB P ts
5 LAN 1 LAN 2 P ts(left) and (right) or
6 A P tVG or
I m t t nte Slo Descrip io
PCIe 5.0 x S t (FH, . L)16 lo 12 3”
PCIe 5.0 x S t (FH, . L)16 lo 12 3”
PCIe 5.0 x8 S t P)(in x16) lo (L
2 4 6531
1
2
3
1
2
3
E st th aach sy em comes wi
unique de aul pas word f t s for
the A IN us . DM er
T a rhis can be found on sticke
on the motherboard and a sticker
unde nea he er agr th t s vice t on
c is.hass
If neces arys , the s npa sword ca
be rese by he upermicr t t S o
IPMIC .FG tool
For more information,
please visit
h p c /tt s:// .swww upermi ro om.c
en olu ion managemen/s t s/ t-
so /ftware
bm -re ourc s ces
Pull ou- t ttag wi h BMC ass unique p word
a ia Numbnd Ser l er Label
under eatn h.
PULL
Item
1
Description
Control Panel Features
2
Universal Information LED
3
NIC1 (Right) and NIC2 (Left) LED
4
HDD LED
5
Power LED
6
UID Button
7
Power Button
8
Drive Activity LED
9
Drive Status LED
Servicel/Asset Tag (pull-out identifier with
BMC ADMIN default password underneath)
HDD1
HDD0
HDD3
HDD2
HDD5
HDD4
HDD7
HDD6
HDD9
HDD8
12
4321
5 6
8
79
I m t nte Descrip io
1
2 A P tVG or
3 Two or 1GbE LAN P ts
4U 3.2 G 1 P / cat LAN SB en orts Dedi ed
f MIor IP
5COM P t (S P t)or erial or
6 COM P t (S P t)or Header erial or
7 : M rJ M1TP TP Heade
8JM2_1 JM2_/ 2: M.2 PCIe 5.0 Interface
(M- 2280 and 22key 110)
9 : P 5.0 x8 orJNVME1 Cle MCIO Connect
10 : U 3.2 G rUS /3B2 SB en1 Heade
I m t nte Descrip io
11 : F t t P rJF1 ron Con rol anel Heade
12 : Int VROC R D Key rJRK1 el AI Heade
13 : P x8 orJNVME2 Cle 5.0 MCIO Connect
14 : P 5.0 x8 orJNVME3 Cle MCIO Connect
15 : P 5.0 x8 orJNVME4 Cle MCIO Connect
16 J MI1IP : t Bus System Managemen
Header or onl (f MI IP y)
17 : N I rJBPNI 12C BP 2C Heade
18 : I t S s rJ N1SE nle en or Heade
19 : NV I rJN 2CVI 1 Me 2C Heade
20 : S S A 3.0 P tsS A 7AT 0- limSAS AT or
21 O Ba ynboard CMOS tter
Press Both Notches
Straight Down to the in
Me ry Slotmo
Notches
Release Tabs
DIMM nstallation I
DI eMM Popul ionat Guid
Type Cha el nn
H1 G1 F1 E1
CPU
A1 B1 C1 D1
1 DIMM V
2 DI sMM V V
4 DI sMM V V V V
8 DI sMM VVVV VVVV
No te: Please refer to user manual for memory module [rank] and [DRAM density] requirements
when using Intel® Xeon® 6 CPU.
Produktspezifikationen
| Marke: | Supermicro |
| Kategorie: | Server |
| Modell: | SuperServer SYS-112B-WR |
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