Intel E5440 Bedienungsanleitung
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Reference Number: 318611 Revision: 001
Quad-Core Intel® Xeon® Processor
5400 Series
Thermal/Mechanical Design Guidelines
November 2007
2 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or
life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Quad-Core Intel® Xeon® 5400 Series may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available upon request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained
by calling1-800-548-4725, or by visiting Intel's website at http://www.intel.com.
Intel, Intel Inside, Xeon, Intel Core and the Intel logo are trademarks or registered trademarks of Intel Corporation or its
subsidiaries in the United States and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2007, Intel Corporation. All rights reserved.
Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3
Contents
1 Introduction ..............................................................................................................9
1.1 Objective ...........................................................................................................9
1.2 Scope ................................................................................................................9
1.3 References .........................................................................................................9
1.4 Definition of Terms ............................................................................................ 10
2 Thermal/Mechanical Reference Design.................................................................... 13
2.1 Mechanical Requirements ................................................................................... 13
2.1.1 Processor Mechanical Parameters ............................................................. 13
2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package............................ 14
2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations................... 18
2.2 Processor Thermal Parameters and Features ......................................................... 19
2.2.1 Thermal Control Circuit and TDP............................................................... 19
2.2.2 Digital Thermal Sensor............................................................................ 20
2.2.3 Platform Environmental Control Interface (PECI) ........................................ 21
2.2.4 Multiple Core Special Considerations ......................................................... 21
2.2.5 Thermal Profile ...................................................................................... 24
2.2.6 TCONTROL Definition .............................................................................. 25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon®
Processor 5400 Series............................................................................. 26
2.2.8 Performance Targets............................................................................... 28
2.3 Fan Fail Guidelines ............................................................................................ 32
2.4 Characterizing Cooling Solution Performance Requirements..................................... 33
2.4.1 Fan Speed Control .................................................................................. 33
2.4.2 Processor Thermal Characterization Parameter Relationships........................ 34
2.4.3 Chassis Thermal Design Considerations ..................................................... 36
2.5 Thermal/Mechanical Reference Design Considerations ............................................ 37
2.5.1 Heatsink Solutions.................................................................................. 37
2.5.2 Thermal Interface Material....................................................................... 38
2.5.3 Summary .............................................................................................. 38
2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 39
2.5.5 Thermal Solution Performance Characteristics ............................................ 41
2.5.6 Thermal Profile Adherence....................................................................... 42
2.5.7 Components Overview ............................................................................ 45
2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel®
Xeon® Processor 5400 Series Thermal Profile ............................................ 49
A 1U Alternative Heatsink Thermal/Mechanical Design............................................... 53
A.1 Component Overview......................................................................................... 53
A.2 Thermal Solution Performance Characterics .......................................................... 54
A.3 Thermal Profile Adherence.................................................................................. 54
B Mechanical Drawings ............................................................................................... 57
C Heatsink Clip Load Methodology .............................................................................. 83
C.1 Overview ......................................................................................................... 83
C.2 Test Preparation................................................................................................ 83
C.2.1 Heatsink Preparation .............................................................................. 83
C.2.2 Typical Test Equipment ........................................................................... 86
C.2.3 Test Procedure Examples ........................................................................ 86
C.2.4 Time-Zero, Room Temperature Preload Measurement ................................. 86
C.2.5 Preload Degradation under Bake Conditions ............................................... 87
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| Marke: | Intel |
| Kategorie: | Prozessor |
| Modell: | E5440 |
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