Intel Core 2 Quad Q6700 Bedienungsanleitung

Intel Prozessor Core 2 Quad Q6700

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Document Number: 315592-005

Intel® Core™2 Extreme Quad-Core

Processor QX6000Δ Sequence and

Intel® Core™2 Quad Processor

Q6000Δ Sequence

Datasheet

—on 65 nm Process in the 775-land LGA Package supporting

Intel® 64 architecture and Intel® Virtualization Technology±

August 2007

2 Datasheet

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT

INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel

® Core™2 quad processor Q6000 sequence may contain design defects or

errors known as errata which may cause the product to deviate from published specifications.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

ΔIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in

clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular

feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/

processor_number for details.

Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64. Processor

will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software

configurations. See http://www.intel.com/technology/intel64/index.htm for more information including details on which processors support Intel 64, or

consult with your system vendor for more information.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check

with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Intel® Virtualization Technology requires a computer system with an enabled Intel

® processor, BIOS, virtual machine monitor (VMM) and, for some

uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations

and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Intel, Pentium, Itanium, Xeon, Intel SpeedStep, andand the Intel logo are trademarks of Intel Corporation in the U.S. and other countries..

*Other names and brands may be claimed as the property of others.

Datasheet 3

Contents

1 Introduction ..............................................................................................................9

1.1 Terminology .......................................................................................................9

1.1.1 Processor Terminology ............................................................................ 10

1.2 References ....................................................................................................... 11

2 Electrical Specifications ........................................................................................... 13

2.1 Power and Ground Lands.................................................................................... 13

2.2 Decoupling Guidelines........................................................................................ 13

2.2.1 VCC Decoupling ..................................................................................... 13

2.2.2 VTT Decoupling...................................................................................... 13

2.2.3 FSB Decoupling...................................................................................... 14

2.3 Voltage Identification......................................................................................... 14

2.4 Reserved, Unused, and TESTHI Signals ................................................................ 16

2.5 Voltage and Current Specification ........................................................................ 17

2.5.1 Absolute Maximum and Minimum Ratings .................................................. 17

2.5.2 DC Voltage and Current Specification ........................................................ 18

2.5.3 VCC Overshoot ...................................................................................... 21

2.5.4 Die Voltage Validation............................................................................. 21

2.6 Signaling Specifications...................................................................................... 22

2.6.1 FSB Signal Groups.................................................................................. 22

2.6.2 CMOS and Open Drain Signals ................................................................. 24

2.6.3 Processor DC Specifications ..................................................................... 24

2.6.3.1 GTL+ Front Side Bus Specifications ............................................. 26

2.7 Clock Specifications ........................................................................................... 26

2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 26

2.7.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 27

2.7.3 Phase Lock Loop (PLL) and Filter .............................................................. 27

2.7.4 BCLK[1:0] Specifications ......................................................................... 28

3 Package Mechanical Specifications .......................................................................... 31

3.1 Package Mechanical Drawing............................................................................... 31

3.2 Processor Component Keep-Out Zones................................................................. 35

3.3 Package Loading Specifications ........................................................................... 35

3.4 Package Handling Guidelines............................................................................... 35

3.5 Package Insertion Specifications.......................................................................... 36

3.6 Processor Mass Specification............................................................................... 36

3.7 Processor Materials............................................................................................ 36

3.8 Processor Markings............................................................................................ 36

3.9 Processor Land Coordinates ................................................................................ 38

4 Land Listing and Signal Descriptions ....................................................................... 39

4.1 Processor Land Assignments ............................................................................... 39

4.2 Alphabetical Signals Reference ............................................................................ 62

5 Thermal Specifications and Design Considerations .................................................. 71

5.1 Processor Thermal Specifications ......................................................................... 71

5.1.1 Thermal Specifications ............................................................................ 71

5.1.2 Thermal Metrology ................................................................................. 76

5.2 Processor Thermal Features................................................................................ 76

5.2.1 Thermal Monitor..................................................................................... 76

5.2.2 Thermal Monitor 2.................................................................................. 77

5.2.3 On-Demand Mode .................................................................................. 78

5.2.4 PROCHOT# Signal .................................................................................. 79

Produktspezifikationen

Marke:	Intel
Kategorie:	Prozessor
Modell:	Core 2 Quad Q6700
Prozessorhersteller:	Intel
Anzahl Prozessorkerne:	4
Produkttyp:	Prozessor
Warentarifnummer (HS):	8542310001
Verpackungsart:	Einzelhandels-Box
Maximale Betriebstemperatur:	62.2 °C
Prozessorfamilie:	Intel® Core™2 Quad
Prozessor:	Q6700
Prozessor-Cache:	8 MB
Frontsidebus des Prozessors:	1066 MHz
Prozessor Cache Typ:	L2
Prozessor-Code:	SLACQ
Prozessor Lithografie:	65 nm
Prozessorbetriebsmodi:	64-Bit
Prozessor-Paketgröße:	37.5 x 37.5 mm
Prozessor-Threads:	4
Stepping:	G0
Thermal Design Power (TDP):	105 W
Prozessorsockel:	LGA 775 (Socket T)
ARK Prozessorerkennung:	30790
Intel® Turbo-Boost-Technologie:	Nein
Eingebettete Optionen verfügbar:	Nein
Intel® 64:	Ja
Intel® Virtualization Technologie (VT-X):	Ja
Warenklassifizierungssystem zur automatisierten Nachverfolgung (CCATS):	NA
Intel® Hyper-Threading-Technik (Intel® HT Technology):	Nein
Verbesserte Intel SpeedStep Technologie:	Ja
Intel® AES New Instructions (Intel® AES-NI):	Nein
Execute Disable Bit:	Ja
Leerlauf Zustände:	Ja
Thermal-Überwachungstechnologien:	Ja
Intel® Trusted-Execution-Technik:	Nein
Bus Typ:	FSB
FSB Gleichwertigkeit:	Nein
Intel® Enhanced Halt State:	Ja
Intel® Demand Based Switching:	Nein
CPU-Multiplikator (Bus-/Kernverhältnis):	10
Tcase:	62.2 °C
Anzahl der Processing Die Transistoren:	582 M
Processing die Größe:	286 mm²
Grundfrequenz des Prozessors:	2.66 GHz
Exportkontroll-Klassifizierungsnummer (ECCN):	3A991.A.1
Box:	Ja
Kühler enthalten:	Ja
Marktsegment:	Desktop
Prozessor Cache:	8192 KB
Status:	Discontinued
Produktfamilie:	Intel Core Processors
Markenname Prozessor:	Intel® Core™2 Quad
Letzte Änderung:	63903513
Startdatum:	Q3'07
VID Spannungsbereich:	0.85 - 1.5 V
Diagonal field of view:	2.66 GHz
Bus-Bandbreite:	1066
Bus-Typ-Einheiten:	MHz
Busgeschwindigkeit:	1066 MHz