Intel Celeron M 360 Bedienungsanleitung

Intel Prozessor Celeron M 360

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Document Number: 303110-008

Intel® Celeron® M Processor

on 90 nm Process

Datasheet

January 2007

2 Datasheet

IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for

use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Celeron® M processor may contain design defects or errors known as errata which may cause the product to deviate from published

specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. See www.intel.com/products/processor_number for details.

Intel, Celeron, MMX, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other

countries.

*Other names and brands may be claimed as the property of others.

Datasheet 3

Contents

1 Introduction ..............................................................................................................7

1.1 Terminology .......................................................................................................8

1.2 References .........................................................................................................8

2 Low Power Features ................................................................................................ 11

2.1 Clock Control and Low Power States .................................................................... 11

2.1.1 Normal State ......................................................................................... 11

2.1.2 AutoHALT Power-Down State ................................................................... 11

2.1.3 Stop-Grant State.................................................................................... 11

2.1.4 HALT/Grant Snoop State ......................................................................... 12

2.1.5 Sleep State ........................................................................................... 12

2.1.6 Deep Sleep State ................................................................................... 13

2.2 FSB Low Power Enhancements............................................................................ 13

2.3 Processor Power Status Indicator (PSI#) Signal..................................................... 14

3 Electrical Specifications ........................................................................................... 15

3.1 Power and Ground Pins ...................................................................................... 15

3.1.1 FSB Clock (BCLK[1:0]) and Processor Clocking........................................... 15

3.2 Voltage Identiﬁcation and Power Sequencing ........................................................ 15

3.3 Catastrophic Thermal Protection .......................................................................... 17

3.4 Signal Terminations and Unused Pins ................................................................... 17

3.5 FSB Frequency Select Signals (BSEL[1:0])............................................................ 17

3.6 FSB Signal Groups............................................................................................. 17

3.7 CMOS Signals ................................................................................................... 19

3.8 Maximum Ratings.............................................................................................. 19

3.9 Processor DC Specifications ................................................................................ 19

4 Package Mechanical Specifications and Pin Information .......................................... 29

4.1 Processor Pinout and Pin List .............................................................................. 37

4.2 Alphabetical Signals Reference ............................................................................ 55

5 Thermal Specifications and Design Considerations .................................................. 63

5.1 Thermal Specifications ....................................................................................... 65

5.1.1 Thermal Diode ....................................................................................... 65

5.1.2 Thermal Diode Offset.............................................................................. 66

5.1.3 Intel® Thermal Monitor........................................................................... 67

Produktspezifikationen

Marke:	Intel
Kategorie:	Prozessor
Modell:	Celeron M 360
Prozessorhersteller:	Intel
Anzahl Prozessorkerne:	1
Produkttyp:	Prozessor
Warentarifnummer (HS):	8473301180
Verpackungsart:	Einzelhandels-Box
Prozessorfamilie:	Intel® Celeron® M
Prozessor:	360
Prozessor-Cache:	1 MB
Frontsidebus des Prozessors:	400 MHz
Prozessor Cache Typ:	L2
Prozessor Codename:	Dothan
Prozessor Lithografie:	90 nm
Prozessorbetriebsmodi:	32-bit
Prozessor-Paketgröße:	35mm x 35mm mm
Prozessor-Threads:	1
Scenario Design Power (SDP) [Szenarienbildungslösung]:	0 W
Systembus-Rate:	- GT/s
Thermal Design Power (TDP):	21 W
Prozessor-Serien:	Intel Celeron M 300 Series
Prozessorsockel:	Socket 478
ARK Prozessorerkennung:	27143
Intel® Turbo-Boost-Technologie:	Nein
Eingebettete Optionen verfügbar:	Nein
Intel® 64:	Nein
Intel® Virtualization Technologie (VT-X):	Nein
Komponente für:	Laptop
ECC:	Nein
Intel® Hyper-Threading-Technik (Intel® HT Technology):	Nein
Verbesserte Intel SpeedStep Technologie:	Nein
Tjunction:	100 °C
Eingebaute Grafikadapter:	Nein
Execute Disable Bit:	Ja
Leerlauf Zustände:	Nein
Intel® Trusted-Execution-Technik:	Nein
Bus Typ:	FSB
FSB Gleichwertigkeit:	Nein
Intel® Enhanced Halt State:	Nein
Intel® Demand Based Switching:	Nein
CPU-Multiplikator (Bus-/Kernverhältnis):	14
Anzahl der Processing Die Transistoren:	144 M
Processing die Größe:	87 mm²
Physical Address Extension (PAE):	32 Bit
Grundfrequenz des Prozessors:	1.4 GHz
Kompatible chipsets:	Intel® 852GM
Box:	Ja
Cache-Speicher:	1 MB
Kühler enthalten:	Ja
Marktsegment:	Mobil
Prozessor Cache:	1024 KB
Status:	Discontinued
Produktfamilie:	Legacy Intel Celeron Processor
Markenname Prozessor:	Intel® Celeron®
Letzte Änderung:	63903513
VID Spannungsbereich:	1.004 - 1.292 V
Produktbezeichnung:	Intel Celeron M 360 (1M Cache, 1.40 GHz, 400 MHz FSB)
Bus-Bandbreite:	400
Bus-Typ-Einheiten:	MHz
Busgeschwindigkeit:	400 MHz
Number of Graphics & IMC Die Transistors:	144 M
Prozessorkern-Spannung:	1.260, 1.004-1.292 V