Texas Instruments SN74CB3Q3257PWR Bedienungsanleitung

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An IMPORTANT NOTICE at the end o f this data sheet addr esses availability, warranty, chan ges, use in safety-critica l applications,

inte llectual property matters and other important disclaimers. PRODUCTION DATA.

SN74CB3Q3257

SCDS135D – SEPTEMBER 2003 – REVISED JULY 201 8

SN74CB3Q3257 4-Bit 1-of-2 FET Multipl exer/Demult iplexer

2.5-V/3.3-V L ow-V oltage High- Bandwidth Bus Switch

(1) For additional information regarding the performance

char acteristics of the CB3Q family, refer to the TI application

report, ,CBT-C, CB3T, and CB3Q Signal-Switch Families

SCDA008.

1 Features

1 • High-Bandwidth Data Path

(up to 500 MHz)

• 5-V Tolerant I/Os With Device Powered Up or

Powered Down

• Low and Flat ON-State Resistance (ron)

Characteristics Over Operating Range

(ron = 4 Typical)Ω

• Rail-to-Rail Switching on Data I/O Ports

– 0- to 5-V Switching With 3.3-V VCC

– 0- to 3.3-V Switching With 2.5-V VCC

• Bidirectional Data Flow With Near-Zero

Propagation Delay

• Low Input and Output Capacitance Minimizes

Loading and Signal Distortion

(Cio(OFF) = 3.5 pF Typical)

• Fast Switching Frequency (f OE = 20 MHz

Maximum)

• Data and Control Inputs Provide Undershoot

Clamp Diodes

• Low Power Consumption

(ICC = 0.7 mA Typical)

• VCC Operating Range From 2.3 V to 3.6 V

• Data I/Os Support 0- to 5-V Signaling Levels

(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)

• Control Inputs Can Be Dri ven by TTL or

5-V/3.3-V CMOS Outputs

• Io Supports Partial-Power-Down Mode Operation

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Supports Both Digital and Analog Applications:

USB Interface, Dierential Signal Interface,

Bus Isolation, Low-Distortion Signal Gating (1)

2 Applications

• IP Phones: Wired and Wireless

• Optical Modules

• Optical Networking: Video Over Fiber and EPON

• Private Branch Exchange (PBX)

• WiMAX and Wireless Infrastruct ure Equipment

3 Description

The SN74CB3Q3257 device is a high-bandwidth FET

bus switc h utilizi ng a charge pump to elevate the gate

voltage of the pass transistor, providing a low and at

ON-state resi stance (ron).

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

SN74CB3Q3257DGV TVSOP (16 ) 3.60 mm × 4.40 mm

SN74CB3Q3257DBQ SSOP (16) 4.90 mm × 3.90 mm

SN74CB3Q3257PW TSSOP (16 ) 5.00 mm × 4.40 mm

SN74CB3Q3257RGY VQFN (16) 4.00 mm × 3.50 mm

(1) For all availa ble packages, see the orderable addendum at

the end of the data sheet.

Logic Diagram (Positive Logic)

SN74CB3Q3257

SCDS135D –SEPTEMBER 2003 – REVISED JULY 2018

www.ti.com

Product Folder Links: SN74CB3Q3257

Table of Contents

1 Features .................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Conguration and Functions ......................... 3

6 Specications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Rating s .............................................................. 4

6.3 Recommended Op erating Conditi ons .. ...... ...... ...... ... 4

6 .4 Thermal Information.................................................. 5

6.5 Electrical Characte risti c s .......................................... 5

6.6 Switching Cha r acteristics, VCC = 2 .5 V ..................... 6

6.7 Switching Cha r acteristics, VCC = 3 .3 V ..................... 6

6.8 Typic al Characteristics .............................................. 6

7 Parameter Measurement Information .................. 7

8 Detailed Description .............................................. 8

8.1 Overview ................................................................... 8

8.2 Functional Block Diagram ......................................... 9

8.3 Feature Desc rip tion................................................... 9

8.4 Device Function al Modes.......................................... 9

9 Application and Implementation ........................ 10

9.1 Application In formation............................................ 10

9.2 Typical App li c atio n ................................................. 10

10 Power Supply Recommendations ..................... 11

11 Layout................................................................... 11

11.1 Lay o ut Guide li nes ................................................. 11

11.2 Layout Ex ample .................................................... 11

12 Device and Documentation Support ................. 12

1 2.1 Docu mentation Sup po rt ........................................ 12

12.2 Receiving Notication of Documentat ion Update s 12

12.3 Community Reso urc es.......................................... 12

12 .4 Trademarks ........................................................... 12

12.5 Electrostatic Di scharge Caution...................... ...... 12

12 .6 Gloss ary ................................................................ 12

13 Mechanical, Packaging, and O r derable

Information ........................................................... 12

4 Revision History

Changes from Revision C (April 2017) to Revision D Page

• Changed the pinout images appe arance .............................................................................................................................. 3

• Added table values ...............................................................................................................................Thermal Information 5

Changes from Revision B (June 2015) to Revision C Page

• Added MA X values f or TA = –40°C to 105°C to the table..............................................................Electrical Characteristics 5

• Added MA X values f or TA = –40°C to 105°C to the Switching Characteristics, V

CC = 2.5 V table. ...................................... 6

• Added separate Switching Characteristics, VCC = 3.3 V for VCC = 3.3 V ± 0. 3 V. Added TYP values and MAX values

for TA = –40°C to 105° C ......................................................................................................................................................... 6

Changes from Revision A (November 2003) to Revision B Page

• Removed table. ....................................................................................................................................Ordering Information 1

• Added table, section, table,Device Information Pin Conguration and Functions ESD Ratings Feature Description

section, , section,Device Functional Modes Application and Implementation Power Supply Recommendations

section, section, section, andLayout Device and Documentation Support Mechanical, Packaging, and Orderable

Information section ................................................................................................................................................................ 1

Thermal

Pad

21B1

31B2

41A

52B1

62B2

72A

8GND

93A

10 3B2

11 3B1

12 4A

13 4B2

14 4B1

15 OE

16 VCC

1 S

Not to scale

1S 16 VCC

21B1 15 OE

31B2 14 4B1

41A 13 4B2

52B1 12 4A

62B2 11 3B1

72A 10 3B2

8GND 9 3A

Not to scale

SN74CB3Q3257

www.ti.com

SCDS135D – SEPTEMBER 2003 – REVISED JULY 201 8

Product Folder Links: SN74CB3Q3257

5 Pin Conguration and Functions

D, DB, DGV, DBQ, or PW Package

16-Pin SOIC, SSOP TVSOP, or TSSOP

Top View

RGY Package

16-Pin VQFN

Top View

Pin Functions

PIN I/O DESCRIPTION

NAME NO.

S 1 I Select Pin

1B1 2 I/O Channel 1 I/O 1

1B2 3 I/O Channel 1 I/O 2

1A 4 I/O Channel 1 common

2B1 5 I/O Channel 2 I/O 1

2B2 6 I/O Channel 2 I/O 2

2A 7 I/O Channel 2 common

GND 8 — Ground

3A 9 I/O Channel 3 common

3B2 10 I/O Channel 3 I/O 2

3B1 11 I/O Channel 3 I/O 1

4A 12 I/O Channel 4 common

4B2 13 I/O Channel 4 I/O 2

4B1 14 I/O Channel 4 I/O 1

OE 15 I Output Enable (Active Low)

VCC 16 — Power

Produktspezifikationen

Marke:	Texas Instruments
Kategorie:	Nicht kategorisiert
Modell:	SN74CB3Q3257PWR
Breite:	5.1 mm
Tiefe:	4.5 mm
Höhe:	1.05 mm
Betriebstemperatur:	-40 - 85 °C
Verpackungsbreite:	364 mm
Verpackungstiefe:	364 mm
Verpackungshöhe:	27 mm
Typ:	Logik-IC
Menge pro Packung:	2000 Stück(e)
Verpackungsart:	TSSOP
Temperaturbereich bei Lagerung:	-65 - 150 °C
Anzahl Pins:	16
Breite (mit Pins):	5.1 mm
Tiefe (mit Pins):	6.6 mm
Höhe (mit Pins):	1.2 mm