Texas Instruments SN74AUP1G17DCKR Bedienungsanleitung

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74AUP1G17

SCES579J – JUNE 2004 – REVISED SEPTEMBER 2017

SN74AUP1G17 Low-Power Single Schmitt-Trigger Buer

1 Features

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Available in the Texas Instruments NanoStar™

Package

• Low Static-Power Consumption

(ICC = 0.9 µA Maximum)

• Low Dynamic-Power Consumption

(Cpd = 4.4 pF Typical at 3.3 V)

• Low Input Capacitance (Ci= 1.5 pF Typical)

• Low Noise – Overshoot and Undershoot

<10% of VCC

• Io Supports Partial-Power-Down Mode Operation

• Includes Schmitt-Trigger Inputs

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode Signal

Operation

• tpd = 5.1 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

2 Applications

• Grid Infrastructure

• PC & Notebooks

• Tablets

• Factory Automation & Control

• Gaming

• Server

3 Description

The AUP family of devices is TI's premier solution to

the industry's low-power needs in battery-powered

portable applications. This family ensures a very low

static- and dynamic-power consumption across the

entire VCC range of 0.8 V to 3.6 V, resulting in

increased battery life. This product also maintains

excellent signal integrity (see AUP – The Lowest-

Power Family Excellent Signal Integrityand ).

This device functions as an independent gate with

Schmitt-trigger inputs, which allows for slow input

transition and better switching-noise immunity at the

input.

NanoStar™ package technology is a major

breakthrough in IC packaging concepts, using the die

as the package.

This device is fully specied for partial-power-down

applications using Io. The Io circuitry disables the

outputs when the device is powered down. This

inhibits current backow into the device which

prevents damage to the device.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

SN74AUP1G17DBV SOT-23 (5) 1.60 mm × 2.90 mm

SN74AUP1G17DCK SC70 (5) 1.25 mm × 2.00 mm

SN74AUP1G17DRL SOT-5X3 (5) 1.60 mm × 1.20 mm

SN74AUP1G17DRY SON (6) 1.00 mm × 1.45 mm

SN74AUP1G17DSF SON (6) 1.00 mm × 1.00 mm

SN74AUP1G17YFP DSBGA (4) 0.76 mm × 0.76 mm

SN74AUP1G17YZP DSBGA (5) 0.89 mm × 1.39 mm

SN74AUP1G17DPW X2SON (5) 0.80 mm × 0.80 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Logic Diagram (Positive Logic)

(DBV, DCK, DPW, DRL, DRT, DRY, and YZP

Packages)

Logic Diagram (Positive Logic)

(YFP Package)

SN74AUP1G17

SCES579J – JUNE 2004 – REVISED SEPTEMBER 2017

www.ti.com

Product Folder Links: SN74AUP1G17

Table of Contents

1 Features .................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Conguration and Functions ......................... 3

6 Specications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics........................................... 5

6.6 Switching Characteristics: CL= 5 pF ........................ 7

6.7 Switching Characteristics: CL= 10 pF ...................... 8

6.8 Switching Characteristics: CL= 15 pF ...................... 8

6.9 Switching Characteristics: CL= 30 pF ...................... 9

6.10 Operating Characteristics........................................ 9

6.11 Typical Characteristics ............................................ 9

7 Parameter Measurement Information ................ 10

7.1 Propagation Delays, Setup and Hold Times, and

Pulse Duration ......................................................... 10

7.2 Enable and Disable Times ...................................... 11

8 Detailed Description ............................................ 12

8.1 Overview ................................................................. 12

8.2 Functional Block Diagrams ..................................... 12

8.3 Feature Description................................................. 12

8.4 Device Functional Modes........................................ 13

9 Application and Implementation ........................ 14

9.1 Application Information............................................ 14

9.2 Typical Application .................................................. 14

10 Power Supply Recommendations ..................... 16

11 Layout................................................................... 16

11.1 Layout Guidelines ................................................. 16

11.2 Layout Example .................................................... 16

12 Device and Documentation Support ................. 17

12.1 Documentation Support ........................................ 17

12.2 Receiving Notication of Documentation Updates 17

12.3 Community Resources.......................................... 17

12.4 Trademarks ........................................................... 17

12.5 Electrostatic Discharge Caution............................ 17

12.6 Glossary ................................................................ 17

13 Mechanical, Packaging, and Orderable

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may dier from page numbers in the current version.

Changes from Revision I (March 2010) to Revision J Page

• Added , table, section, table,Applications Device Information Pin Conguration and Functions ESD Ratings Thermal

Information Feature Description Application and Implementation Power Supplytable, section, section,

Recommendations Layout Device and Documentation Support Mechanical,section, section, section, and

Packaging, and Orderable Information section ...................................................................................................................... 1

• Deleted table, see at the end of the dataOrdering Information Mechanical, Packaging, and Orderable Information

sheet ...................................................................................................................................................................................... 1