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SNx5HVD308xE Low-Power RS-485 Transceivers

1 Features

• Meets or exceeds the requirements of the TIA/

EIA-485A standard

• Low quiescent power

– 0.3-mA Active mode

– 1-nA Shutdown mode

• 1/8 Unit load up to 256 nodes on a bus

• Bus-pin ESD protection up to 15 kV

• Industry-standard SN75176 footprint

• Fail-safe receiver (bus open, bus shorted,

bus idle)

• Glitch-free power-up and power-down bus inputs

and outputs

2 Applications

•Energy meter networks

•Motor control

• Power inverters

•Industrial automation

• networksBuilding automation

• applicationsBattery-powered

• Telecommunications equipment

3 Description

The SNx5HVD308xE are half-duplex transceivers

designed for RS-485 data bus networks. Powered

by a 5-V supply, they are fully compliant with TIA/

EIA-485A standard. With controlled transition times,

these devices are suitable for transmitting data over

long twisted-pair cables. The SN65HVD3082E and

SN75HVD3082E are optimized for signaling rates

up to 200 kbps. The SN65HVD3085E is suitable

for data transmission up to 1 Mbps, whereas the

SN65HVD3088E is suitable for applications that

require signaling rates up to

20 Mbps.

These devices are designed to operate with very

low supply current, typically 0.3 mA, exclusive of the

load. When in the inactive-shutdown mode, the supply

current drops to a few nanoamps, which makes these

devices ideal for power-sensitive applications.

The wide common-mode range and high ESD

protection levels of these devices, make them suitable

for demanding applications such as energy meter

networks, electrical inverters, status and command

signals across telecom racks, as well as cabled

chassis interconnects, and industrial automation

networks where noise tolerance is essential. These

devices match the industry-standard footprint of the

SN75176 device. The power-on-reset circuits keep

the outputs in a high-impedance state until the

supply voltage has stabilized. A thermal-shutdown

function protects the device from damage, due to

system fault conditions. The SN75HVD3082E is

characterized for operation from 0°C to 70°C and

SN65HVD308xE is characterized for operation from –

40°C to 85°C air temperature. The D package version

of the SN65HVD3082E has been characterized for

operation from –40°C to 105°C.

Device Information

PART NUMBER PACKAGE(1) BODY SIZE (NOM)

SN65HVD3082E

SN65HVD3088E

SOIC (D) (8) 4.90 mm × 3.91 mm

VSSOP (DGK) (8) 3.00 mm × 3.00 mm

PDIP (P) (8) 9.81 mm × 6.35 mm

SN75HVD3082E

SN65HVD3085E

SOIC (D) (8) 4.90 mm × 3.91 mm

VSSOP (DGK) (8) 3.00 mm × 3.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

space

RTRT

A B

R RE DE D

A B

R RE DE D

Simplified Schematic

SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E

SLLS562M – AUGUST 2009 – REVISED FEBRUARY 2022

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................4

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings........................................ 4

6.2 ESD Ratings............................................................... 4

6.3 Recommended Operating Conditions.........................5

6.4 Thermal Information, SN65HVD308xE....................... 5

6.5 Thermal Information, SNx5HVD3082E....................... 5

6.6 Electrical Characteristics: Driver.................................6

6.7 Electrical Characteristics: Receiver............................ 6

6.8 Electrical Characteristics.............................................7

6.9 Switching Characteristics: Driver................................ 7

6.10 Switching Characteristics..........................................8

6.11 Typical Characteristics.............................................. 9

7 Parameter Measurement Information.......................... 11

8 Detailed Description......................................................15

8.1 Overview...................................................................15

8.2 Functional Block Diagram......................................... 15

8.3 Feature Description...................................................15

8.4 Device Functional Modes..........................................15

9 Application and Implementation.................................. 17

9.1 Application Information............................................. 17

9.2 Typical Application.................................................... 17

10 Power Supply Recommendations..............................21

11 Layout...........................................................................21

11.1 Layout Guidelines................................................... 21

11.2 Layout Example...................................................... 21

11.3 Thermal Considerations for IC Packages............... 22

12 Device and Documentation Support..........................23

12.1 Device Support....................................................... 23

12.2 Related Links.......................................................... 23

12.3 Receiving Notification of Documentation Updates..23

12.4 Support Resources................................................. 23

12.5 Trademarks.............................................................23

12.6 Electrostatic Discharge Caution..............................23

12.7 Glossary..................................................................23

13 Mechanical, Packaging, and Orderable

Information.................................................................... 24

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision L (November 2021) to Revision M (February 2022) Page

• Added storage temperature Tstg to table................................................................Absolute Maximum Ratings 4

• Changed the table................................................................................Thermal Information, SN65HVD308xE 5

Changes from Revision K (July 2021) to Revision L (November 2021) Page

• Deleted : Available in a small MSOP-8 package ...................................................................................Feature 1

• Deleted Available in a Small MSOP-8 Package from the title.............................................................................1

• Changed the ψJT D package value from 78.8 to 8.8 in the ..................Thermal Information, SNx5HVD3082E 5

Changes from Revision J (October 2017) to Revision K (July 2021) Page

• Changed the tables...........................................................................................................Thermal Information 5

Changes from Revision I (September 2016) to Revision J (October 2017) Page

• Changed 3.3 V to 5 V on the VCC pin in .........................................................................................Figure 9-4 19

Changes from Revision H (August 2015) to Revision I (September 2016) Page

• Added text to the "The D package version of the SN65HVD3082E has been characterized for Description,

operation from -40°C to 105°C."......................................................................................................................... 1

• Changed the Operating free-air temperature for SN65HVD3082E (D package) From: MAX = 85°C To: 105°C

in .....................................................................................................................................................Section 6.3 5

SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E

SLLS562M – AUGUST 2009 – REVISED FEBRUARY 2022 www.ti.com

Product Folder Links: SN65HVD3082E SN75HVD3082E SN65HVD3085E SN65HVD3088E

Changes from Revision G (May 2009) to Revision H (August 2015) Page

• Added section, table, section, Pin Configuration and Functions ESD Ratings Feature Description Device

Functional Modes Application and Implementation Power Supply Recommendations Layout , section, section,

section, section, and Device and Documentation Support Mechanical, Packaging, and Orderable Information

section ............................................................................................................................................................... 1

• Deleted table ......................................................................................................................Dissipation Ratings 1

• Deleted table .....................................................................................................Package Thermal Information 6

Changes from Revision F (March 2009) to Revision G (May 2009) Page

• Added Graph - Driver Rise and Fall Time vs Temperature ................................................................................9

• Added IDLE Bus to the Table.............................................................................................................Function 15

• Added section.....................................................................................................................Receiver Fail-safe 19

www.ti.com

SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E

SLLS562M – AUGUST 2009 – REVISED FEBRUARY 2022

Product Folder Links: SN65HVD3082E SN75HVD3082E SN65HVD3085E SN65HVD3088E

Produktspezifikationen

Marke:	Texas Instruments
Kategorie:	Nicht kategorisiert
Modell:	SN65HVD3082EP
Breite:	10.16 mm
Tiefe:	6.6 mm
Höhe:	4.57 mm
Betriebstemperatur:	-40 - 85 °C
Verpackungsbreite:	13.97 mm
Verpackungstiefe:	506 mm
Verpackungshöhe:	11.23 mm
Menge pro Packung:	50 Stück(e)
Verpackungsart:	PDIP
Temperaturbereich bei Lagerung:	-65 - 150 °C
Anzahl Pins:	8
Breite (mit Pins):	10.16 mm
Tiefe (mit Pins):	10.92 mm
Höhe (mit Pins):	8.26 mm