Texas Instruments LMC6484IM/NOPB Bedienungsanleitung

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LMC6484

SNOS675D – AUGUST 2000 – REVISED JUNE 2020

LMC6484 CMOS, Quad, Rail-to-Rail Input and Output, Operational Amplier

1 Features

• Rail-to-rail input common-mode voltage range

(specied over temperature)

• Rail-to-rail output swing (within 20 mV of supply

rail, 100-k load)Ω

• Specied 3-V, 5-V and 15-V performance

• Excellent CMRR and PSRR: 82 dB

• Ultra-low input current: 20 fA

• High voltage gain (RL= 500 k ): 130 dBΩ

• Specied for 2-k and 600- loadsΩ Ω

2 Applications

•Data acquisition (DAQ)

•Currency counter

•Oscilloscope (DSO)

•Intra-DC interconnect (METRO)

•Macro remote radio unit (RRU)

•Multiparameter patient monitor

•Merchant telecom rectiers

•Train control and management

•Process analytics (pH, gas, concentration, force,

and humidity)

•Three phase UPS

• Improved replacement for TLC274, TLC279

3 Description

The LMC6484 device provides a common-mode

range that extends to both supply rails. This rail-to-rail

performance combined with excellent accuracy, due

to a high CMRR, makes this device unique among

rail-to-rail input ampliers.

The LMC6484 is an excellent choice for systems,

such as data acquisition, that require a large input

signal range. The device is also an excellent upgrade

for circuits using limited common-mode range

ampliers, such as the and .TLC274 TLC279

Maximum dynamic signal range is maintained in low

voltage and single-supply systems by the rail-to-rail

output swing of the LMC6484. The rail-to-rail output

swing of the LMC6484 is specied for loads down to

600 .Ω

Specied low voltage characteristics and low power

dissipation make the LMC6484 an excellent choice

for battery-operated systems.

See the for a dual CMOS operationalLMC6482

amplier with these same features.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LMC6484 SOIC (14) 8.65 mm × 3.91 mm

PDIP (14) 19.177 mm × 6.35 mm

(1) For all available packages, see the package option addendum

at the end of the data sheet.

Single-Ended Unity Gain Buer

LMC6484

SNOS675D – AUGUST 2000 – REVISED JUNE 2020

www.ti.com

Product Folder Links: LMC6484

Table of Contents

1 Features .................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Conguration and Functions ......................... 3

6 Specications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 DC Electrical Characteristics for LMC6484AI ........... 5

6.6 DC Electrical Characteristics for LMC6484I.............. 7

6.7 DC Electrical Characteristics for LMC6484M............ 9

6.8 DC Electrical Characteristics for LMC6484AI ......... 11

6.9 DC Electrical Characteristics for LMC6484I............ 11

6.10 DC Electrical Characteristics for LMC6484M........ 12

6.11 AC Electrical Characteristics for LMC6484A ........ 13

6.12 AC Electrical Characteristics for LMC6484I .......... 13

6.13 AC Electrical Characteristics for LMC6484M........ 14

6.14 AC Electrical Characteristics: V+= 3 V, V−= 0 V . 14

6.15 Typical Characteristics .......................................... 15

7 Detailed Description ............................................ 23

7.1 Overview ................................................................. 23

7.2 Functional Block Diagram ....................................... 23

7.3 Feature Description................................................. 23

7.4 Device Functional Modes........................................ 24

8 Application and Implementation ........................ 25

8.1 Application Information............................................ 25

8.2 Typical Application ................................................. 25

8.3 System Examples ................................................... 31

9 Power Supply Recommendations ...................... 36

10 Layout................................................................... 36

10.1 Layout Guidelines ................................................. 36

10.2 Layout Example .................................................... 37

11 Device and Documentation Support ................. 38

11.1 Device Support...................................................... 38

11.2 Documentation Support ........................................ 38

11.3 Support Resources ............................................... 38

11.4 Trademarks ........................................................... 38

11.5 Electrostatic Discharge Caution............................ 38

11.6 Glossary ................................................................ 38

12 Mechanical, Packaging, and Orderable

Information ........................................................... 38

4 Revision History

NOTE: Page numbers for previous revisions may dier from page numbers in the current version.

Changes from Revision C (September 2015) to Revision D Page

• Deleted old note 3 from table .........................................................................DC Electrical Characteristics for LMC6484AI 5

• Deleted old note 3 from table ...........................................................................DC Electrical Characteristics for LMC6484I 7

• Deleted old note 3 from table ........................................................................DC Electrical Characteristics for LMC6484M 9

Changes from Revision B (August 2000) to Revision C Page

• Added table, section, ,ESD Ratings Feature Description Device Functional Modes Application and Implementation

section, section, section, section, andPower Supply Recommendations Layout Device and Documentation Support

Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1