Goodram GR2666S464L19S/4G Bedienungsanleitung

Goodram Nicht kategorisiert GR2666S464L19S/4G

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SAFETY MEASURES
To ensure the best user experience and safe use, please follow the
precautions listed below:
Do not:
źexpose this product to potential damage and excess heat or extremely
low temperatures
źimmerse any part of this product in water or other liquid
źplace the product near the naked flame
C :aution
źprovide accurate heat dissipation
źthis product is not a toy and is not intended for children under
the age of three
źuse this product only with compatible devices
MANUFACTURER'S ARRANTYW
Warranty conditions are listed in separate document, available at product
website at www.goodram.com/warranty
MANUFACTURER
Wilk Elektronik SA
Mikolowska 42
43-173 Laziska Gorne
Poland
It is forbidden to place the product near the naked flame.
It is forbidden to immerse any part of this product in water or other
liquid, especially when it operates.
It is forbidden to expose this product to potential damage and excess
heat or extremely low temperatures that do not comply with the
product specification.
USAGE AND COMPATIBILITY
Product intended for use as an internal memory in desktop computers
and laptops.
Memory modules can be divided into DIMM – for desktop computers (PC)
and SO-DIMM – for laptops. To select correct memory module, check
the connector standard in your host device (SDR, DDR, DD 2, DDR3, DDR4). R
Standards differ in operating frequency and shape of the edge connector
(number of pins, notch positioning).
In case of connecting a memory module with higher capacity than supported
by the host device, memory can be reduced (please refer to the technical
specification of your device).
INSTALLATION
Before installing the memory module, your computer must be turned off
and unplugged from the power source and the case side panel must be
removed.
Remove the old memory module and install the new one in correct memory
slot with the matching notch position. When the memory is placed into the
slot correctly, the side case can be closed and computer can be turned on.
The new memory module will be recognized by the operating system.
CAPACITY
S memory modulestorage capacity for GOODRAM is always expressed
in decimal values. That means, 1GB equals 1 000 000 000 bytes. Operating
system that use the binary conversion eg. 1GB equals 1 073 741 824 bytes
may show lower storage capacity value than advertised. Additionally,
a part of the storage is reserved for files and firmware, managing the drive.
USER MANUAL
FOR MEMORY MODULES „RAM”
EN
Thank You for choosing GOODRAM product. Before the first use, please read
this user manual to learn about how to use and store this product.
We recommend to retain this manual for future read.
REFER S TO THE FOLLOWING PRODUCTS:
GOODRAM DDR1 DIMM/SODIMM
GOODRAM DDR2 DIMM/SODIMM
GOODRAM DDR3 DIMM/SODIMM
GOODRAM DDR4 DIMM/SODIMM
and future products from the series
SYMBOL EXPLANATION
Below you will find explanation of symbols used in this manual. Please read
this important information before continuing.
Manufacturer declares that this product, marked with CE sign,
conforms with the essential requirements contained in EU directives
Responsible for CE marking is Wilk Elektronik SA, with its registered
office in Laziska Gorne 43-173, Mikolowska 42, Poland. Copy of the
declaration can be obtained by contacting Wilk Elektronik SA.
This product may not be treated as a household waste. It should
be utilized in appropriate recycling center.
The product can be recycled which means that materials used for its
production can be reused.
The product is not a toy and is not intended for children under
the age of three.


Produktspezifikationen

Marke: Goodram
Kategorie: Nicht kategorisiert
Modell: GR2666S464L19S/4G
Warentarifnummer (HS): 84733020
Verpackungsart: Sichtverpackung
Speicherkapazität: 4 GB
Interner Speichertyp: DDR4
Komponente für: Laptop
Speicherkanäle: Einfach-Kanal
ECC: Nein
Speichertaktfrequenz: 2666 MHz
Memory Formfaktor: 260-pin SO-DIMM
Speicherspannung: 1.2 V
Gepufferter Speichertyp: Unregistered (unbuffered)
CAS Latenz: 19
Speicherlayout (Module x Größe): 1 x 4 GB
Modulkonfiguration: 512M x 8

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