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User's Guide

QTouch® Modular Library Peripheral Touch Controller

User's Guide

Description

The Microchip QTouch® Peripheral Touch Controller (PTC) offers built-in hardware for capacitive touch measurement

on sensors that function as buttons, sliders, and wheels. The PTC supports both mutual and self-capacitance

measurements without the need for any external component. It offers superb sensitivity and noise tolerance, as well

as self-calibration, and minimizes the sensitivity tuning effort by the user. It also extends the support for capacitive

touch surface and gesture functionality.

The PTC is intended for autonomously performing capacitive touch sensor measurements. The external capacitive

touch sensor is typically formed on a PCB, and the sensor electrodes are connected to the analog charge integrator

of the PTC using the device I/O pins. The PTC supports mutual capacitance sensors organized as capacitive touch

matrices in different X-Y configurations, including Indium Tin Oxide (ITO) sensor grids. In Mutual Capacitance mode,

the PTC requires one pin per X-line (driveline) and one pin per Y-line (sense line). In Self-Capacitance mode, the

PTC requires only one pin with a Y-line driver for each self-capacitance sensor.

Features

• Implements Low-Power, High-Sensitivity, Environmentally Robust Capacitive Touch Buttons

• Supports Mutual Capacitance and Self-Capacitance Sensing

• Up to 46 Buttons in Self-Capacitance mode

• Up to 529 Buttons in Mutual Capacitance mode

• Supports Lumped Mode Configuration

• One Pin Per Electrode

• Load Compensating Charge Sensing

• Parasitic Capacitance Compensation for Mutual Capacitance mode

• Adjustable Gain for Superior Sensitivity

• Zero Drift Over the Temperature and VDD Range

• No Need for Temperature or VDD Compensation

• Hardware Noise Filtering and Noise Signal De-Synchronization for High Conducted Immunity

• Atmel Start QTouch Configurator Support – Wizard Guided Touch Project Creation

Product Support

For assistance related to QTouch capacitive touch sensing software libraries and related issues, contact your local

Microchip sales representative or visit https://www.microchip.com/support/.

Table of Contents

Description..................................................................................................................................................... 1

Features......................................................................................................................................................... 1

Product Support............................................................................................................................................. 1

1. Introduction............................................................................................................................................. 5

2. Capacitive Touch Measurement..............................................................................................................6

2.1. Self-Capacitance..........................................................................................................................6

2.2. Mutual Capacitance......................................................................................................................7

3. Touch Sensors...................................................................................................................................... 10

3.1. Buttons....................................................................................................................................... 10

3.2. Proximity Sensor........................................................................................................................ 10

3.3. Lumped Sensor..........................................................................................................................10

3.4. Interpolated Sensors.................................................................................................................. 11

3.5. 2D Position Sensors................................................................................................................... 11

3.6. Mix and Match............................................................................................................................ 11

4. PTC....................................................................................................................................................... 12

4.1. Overview.................................................................................................................................... 12

4.2. Self-Capacitance........................................................................................................................12

4.3. Mutual Capacitance....................................................................................................................12

5. QTouch® Modular Library......................................................................................................................14

5.1. Introduction.................................................................................................................................14

5.2. QTouch® Library Modules.......................................................................................................... 14

5.3. Module Naming Conventions..................................................................................................... 14

5.4. QTouch® Library Application Interface....................................................................................... 16

5.5. Application Flow......................................................................................................................... 17

5.6. MISRA Compliance.................................................................................................................... 17

6. Acquisition Module................................................................................................................................ 19

6.1. Overview.................................................................................................................................... 19

6.2. Interface..................................................................................................................................... 19

6.3. Functional Description................................................................................................................19

6.4. Configuration..............................................................................................................................20

7. Boost Mode........................................................................................................................................... 26

7.1. Introduction.................................................................................................................................26

7.2. Configuration..............................................................................................................................26

8. Frequency Hop Module.........................................................................................................................32

8.1. Overview.................................................................................................................................... 32

8.2. Interface..................................................................................................................................... 32

8.3. Functional Description................................................................................................................33

8.4. Configuration..............................................................................................................................33

User's Guide

9. Frequency Hop Auto-Tune Module....................................................................................................... 36

9.1. Overview.................................................................................................................................... 36

9.2. Interface..................................................................................................................................... 36

9.3. Functional Description................................................................................................................37

9.4. Configuration..............................................................................................................................38

10. Touch Key Module.................................................................................................................................40

10.1. Overview.................................................................................................................................... 40

10.2. Interface..................................................................................................................................... 40

10.3. Functional Description................................................................................................................41

10.4. Configuration.............................................................................................................................. 42

11. Scroller Module..................................................................................................................................... 45

11.1. Overview.................................................................................................................................... 45

11.2. Interface..................................................................................................................................... 45

11.3. Functional Description................................................................................................................46

11.4. Configuration..............................................................................................................................47

12. 2D Surface (One-Finger Touch) CS Module......................................................................................... 50

12.1. Overview.................................................................................................................................... 50

12.2. Interface..................................................................................................................................... 50

12.3. Functional Description................................................................................................................51

12.4. Operation....................................................................................................................................52

12.5. Configuration.............................................................................................................................. 52

13. 2D Surface (Two-Finger Touch) CS/2T Module.................................................................................... 55

13.1. Overview.................................................................................................................................... 55

13.2. Interface..................................................................................................................................... 56

13.3. Functional Description................................................................................................................57

13.4. Operation....................................................................................................................................58

13.5. Configuration.............................................................................................................................. 58

14. Gestures Module...................................................................................................................................61

14.1. Overview.................................................................................................................................... 61

14.2. Interfaces to Module...................................................................................................................62

14.3. Configuration.............................................................................................................................. 62

15. Binding Layer Module........................................................................................................................... 65

15.1. Overview.................................................................................................................................... 65

15.2. Interface..................................................................................................................................... 65

15.3. Functional Description................................................................................................................66

15.4. Configuration.............................................................................................................................. 68

16. Building Applications Using Atmel START............................................................................................ 70

17. Using Data Visualizer with QTouch® Applications.................................................................................71

17.1. Overview.................................................................................................................................... 71

17.2. Datastreamer Module.................................................................................................................71

17.3. Debugging Using Data Visualizer...............................................................................................72

17.4. Debugging Using 2D Touch Surface Utility................................................................................ 76

User's Guide

18. Tuning Procedure..................................................................................................................................77

18.1. Tuning for Noise Performance....................................................................................................77

18.2. Tuning the Slider/Wheel Sensor.................................................................................................82

19. Known Issues........................................................................................................................................85

20. Appendix A - Revision History...............................................................................................................86

21. Appendix B - Acquisition Module API Reference.................................................................................. 87

22. Appendix C - Frequency Hop Module API Reference...........................................................................89

23. Appendix D - Frequency Hop Auto-tune Module API Reference.......................................................... 90

24. Appendix E - Touch Key Module API Reference...................................................................................91

25. Appendix F - Scroller Module API Reference....................................................................................... 92

26. Appendix G - 2D Surface (One-Finger Touch) CS Module................................................................... 93

27. Appendix H - 2D Surface (Two-Finger Touch) CS/2T Module.............................................................. 94

28. Appendix I - Gestures Module...............................................................................................................95

29. Appendix J - Binding Layer Module API Reference.............................................................................. 96

30. Appendix K - Device Support................................................................................................................ 97

The Microchip Website.................................................................................................................................98

Product Change Notification Service............................................................................................................98

Customer Support........................................................................................................................................ 98

Microchip Devices Code Protection Feature................................................................................................ 98

Legal Notice................................................................................................................................................. 98

Trademarks.................................................................................................................................................. 99

Quality Management System....................................................................................................................... 99

Worldwide Sales and Service.....................................................................................................................100

User's Guide

1. Introduction

The QTouch® Modular Library (QTML) provides the touch-sensing functionality of a QTouch Library under a modular

architecture. By dividing the library into functional units, an application developer can include only those modules

which provide functionality relevant to the target application, thereby saving both device memory and processing

time.

User's Guide

Introduction

2. Capacitive Touch Measurement

The QTouch Modular Library supports PTC measurement of self-capacitance and mutual capacitance touch sensors

on a selection of AVR®, Arm® Cortex-M0+, Arm Cortex-M23, and Arm Cortex-M4 microcontrollers.

In all current capacitive touch measurement methods, one of two basic functional approaches is implemented: Self-

capacitance or mutual capacitance.

2.1 Self-Capacitance

Self-capacitance refers to a capacitive measurement using a single sensor electrode to measure the apparent

capacitance between the electrode and the DC ground of the touch sensor MCU circuit.

At power-on or Reset, a baseline measurement of the capacitance is recorded and assumed to be the ‘Out Of Touch’

capacitance. Reference capacitance is the combination of Cp in parallel to the series pair Cg and Cx.

When a touch contact is applied, the capacitance is increased by the introduction of a parallel path to earth, via the

series combination of Ct and Ch. The increase is compared to the touch threshold, and if exceeded, the sensor is

indicated to be ‘In Touch’.

Note: Cx, the human body capacitance, varies by person and surroundings and is typically in the order of 100 pF to

200 pF. The touch contact Ct, however, is more consistent and much smaller at typically 1 pF to 5 pF, depending

primarily on the design and construction of the touch sensor and secondly on the size of the finger used to activate

the sensor.

As the dominant component in a pair of series capacitors is the smaller one, in this case, Ct, a well-designed and

tuned sensor shows very consistent sensitivity to touch contact with little dependence on the user.

User's Guide

Capacitive Touch Measurement

2.2 Mutual Capacitance

Mutual capacitance refers to a capacitive measurement using a pair of sensor electrodes to measure the apparent

capacitance between them. Typically, one electrode acts as the Driver (X), while the other is the receiver (Y). Each

physical location where an X electrode transfers charge to a Y electrode is a sensor node, and this is the location of

touch sensitivity.

User's Guide

Capacitive Touch Measurement

As with self-capacitance, a baseline measurement of the capacitance is recorded and assumed to be the ‘Out Of

Touch’ capacitance. Reference capacitance is the apparent capacitance between the X electrode and the Y

electrode. Unlike self-capacitance, the reference capacitance does not depend on an earth return.

Interaction between a mutual capacitance sensor and the human body is more complex. It may be modeled by

considering two separate touch contacts to the X and Y electrodes, where each is capacitively coupled to the body,

resistively connected to each other inside the body and capacitively coupled to earth via the human body

capacitance.

A touch contact has two competing effects:

• The introduction of a conductive plate (finger) to both X and Y electrodes increases the capacitance between X

and Y. This occurs if any conductive part is placed over the sensor.

• The addition of another capacitance (Ch + Cg) at the XY node provides an alternative path for the energy

emitted by the X electrode, reducing the amount of charge accumulated on the sensor. This effect is manifested

as an apparent reduction in the XY capacitance and occurs only if the body of material connected to the

conductive part has a significant self-capacitance.

When a real touch contact is placed, the second (reducing) effect is much greater than the first (increasing) effect,

and so a touch contact on a mutual capacitance sensor is indicated by an apparent reduction in sensor capacitance.

This apparent change in capacitance (delta) is compared to the configured touch threshold, and if it exceeds the

threshold, then the sensor is deemed to be in detect.

User's Guide

Capacitive Touch Measurement

User's Guide

Capacitive Touch Measurement

3. Touch Sensors

Capacitive sensors may be implemented to simply detect contact as a button replacement, or functionally extended

to provide a relative measurement of distance (proximity), 1D position (slider or wheel), 2D position (QTouch

Surface), or 3D position (QTouch Surface with proximity).

In each case, the modular library detects a touch contact by a change in capacitance exceeding a pre-configured

threshold. Once a contact has been confirmed, the various post-processing modules use the calculated touch delta to

interpolate amongst neighboring sensors and calculate the location of the touch position or relative proximity.

3.1 Buttons

The simplest implementation of a capacitive sensor is a button, where the sensor consists of a single node (one

electrode for self-capacitance, one pair of electrodes for mutual capacitance) and is interpreted as a binary state; In

Detect or Out of Detect.

3.2 Proximity Sensor

An extension of the button is a proximity sensor. A single sensor node is monitored for a change in capacitance

exceeding a pre-configured threshold. In the same way as the button, the sensor is considered to be when‘In Detect’

that threshold is exceeded. Once in detect, a relative measurement of the contact distance is made by scaling the

touch delta between two thresholds - the initial threshold and a second threshold.‘Detect’ ‘Full Contact’

Note: As the proximity sensor relies on the capacitive load of a distant object, the ‘apparent distance’ to the contact

will depend on the shape and size of the contact.

I.e., an open hand in proximity at 10 cm will ‘appear’ closer than an extended finger at 10 cm, as it has a larger

influence on capacitance due to a larger surface area at the same distance.

Capacitance (C) is proportional to Area (A) and inversely proportional to distance (d). Also, the grounding has a

significant impact on sensitivity, and so does the range.

  



3.3 Lumped Sensor

A Lumped sensor is implemented as a combination of multiple sense lines (self-capacitance measurement) or

multiple drive and sense lines (mutual capacitance measurement) to act as one single sensor. This provides the

application developer with greater flexibility in the touch sensor implementation.

• Improve the touch sensor responsiveness by reducing the number of measurements and therefore, the time

required for initial touch detection

• Fast position resolution by binary search

• Improved moisture rejection through ‘All but one’ key lumping in a touch button application

• Provide wake-on-touch functionality on any key (up to maximum capacitance limits) with significantly lower

power consumption as only one sensor measurement is required for all keys

• Dual-purpose sensor electrodes – e.g., individual keys may be lumped together to form a proximity sensor

Touch detection on a lumped sensor is implemented in the same way as a single node touch button. The capacitance

of the lump sensor is equal to or more than the sum of the individual sensors’ capacitance. Lumping too many sensor

may result in saturation. In general, the capacitance of the self-capacitance sensor is higher than the mutual

capacitance sensor. The number of sensor electrodes that can be lumped is relatively less for self-capacitance

designs.

User's Guide

Touch Sensors

4. PTC

4.1 Overview

The Microchip QTouch® Peripheral Touch Controller (PTC) offers built-in hardware for capacitive touch measurement

on sensors that function as buttons, sliders, and wheels. The PTC supports both mutual and self-capacitance

measurements without the need for any external components. It offers superb sensitivity and noise tolerance, as well

as self-calibration, and minimizes the sensitivity tuning effort by the user.

The PTC is intended for autonomously performing capacitive touch sensor measurements. The external capacitive

touch sensor is typically formed on a PCB, and the sensor electrodes are connected to the analog charge integrator

of the PTC using the device I/O pins. The PTC supports mutual capacitance sensors organized as capacitive touch

matrices in different X-Y configurations, including Indium Tin Oxide (ITO) sensor grids.

4.2 Self-Capacitance

In Self-Capacitance mode, the PTC requires only one pin with a Y-line driver for each self-capacitance sensor.

Figure 4-1. Self-Capacitance PTC Measurement

4.3 Mutual Capacitance

In Mutual Capacitance mode, the PTC requires one pin per X-line (driveline) and one pin per Y-line (sense line).

User's Guide

PTC

Figure 4-2. Mutual Capacitance PTC Measurement

User's Guide

PTC

5. QTouch® Modular Library

5.1 Introduction

The QTouch Modular Library provides the touch-sensing functionality of a QTouch Library under the redesigned

modular architecture. By dividing the library into functional units, it is possible for an application developer to include

only those modules which provide functionality relevant to the target application, thereby saving both device memory

and processing time.

5.2 QTouch® Library Modules

QTouch Library modules can be classified into three types based on the functionality, as shown below.

5.3 Module Naming Conventions

The naming conventions followed on the QTouch Library modules are given below.

qtm _ <module_name_identifier> _ <device_architecture> _ <module_ID> .

qtm / libqtm

An acronym that indicates QTouch module. All QTouch modules begin with “ ”qtm_

for easy identification.

For GCC modules, “ ” is prepended to the module name, thus it would belib

“ ”.libqtm

User's Guide

QTouch® Modular Library

module_name_identifier

acq – acquisition module with auto-tune

acq_runtime – acquisition module without auto-tune code

freq_hop – frequency hop module

freq_hop_auto_tune – frequency hop with auto-tune module

device_architecture

cm0p – for all Cortex M0+ post processing modules

cm4 – for all Cortex M4F post processing modules

samd1x – SAM D10/D11 acquisition modules only

t81x – all modules of AVR ATtiny817 device families

t161x - all modules of AVR ATtiny1617 device families

t321x - all modules of AVR ATtiny3217 device families

m328pb - all modules of AVR ATmega328PB device

m324pb- all modules of AVR ATmega324PB device

saml21 - SAM L21 acquisition module only

saml22 - SAM L22 acquisition module only

samc21 - SAM C21 acquisition module only

samc20 - SAM C20 acquisition module only

samd21 - SAM D21 acquisition module only

samda1 - SAM DA1 acquisition module only

samha1 - SAM HA1 acquisition module only

samd20 - SAM D20 acquisition module only

saml10 - SAM L10 acquisition module only

saml11 - SAM L11 acquisition module only

cm23 – for all Cortex M23 post processing modules

module_id Unique 16-bit identifier for each module

file_extension .a – GCC modules of AVR® and Arm® devices, IAR modules of Arm devices

.r90 – IAR modules of all AVR modules

User's Guide

QTouch® Modular Library

See examples below:

Table 5-1. Acquisition Module of AVR® ATmega328PB Device

GCC module libqtm_acq_m328pb_0x0001.a

IAR module qtm_acq_m328pb_0x0001.r90

Touch Keys Processing Module of SAM D2x, SAM DA1, SAM HA1, SAM D1x, SAM L2x, SAM C2x Devices

GCC module libqtm_touch_key_cm0p_0x0002.a

IAR module qtm_touch_key_cm0p_0x0002.a

Touch Keys Processing Module of SAM L1x Devices

GCC module libqtm_touch_key_cm23_0x0002.a

IAR module qtm_touch_key_cm23_0x0002.a

5.4 QTouch® Library Application Interface

In addition to library modules, the various components that are required to build the complete touch application are

given below.

1. Module API files.

2. and files.Touch.c Touch.h

3. .Common_components_api.h

4. .Touch_api_ptc.h

5. Module reburst flag.

6. Binding layer module.

5.4.1 Module API files

The API for each module is defined in its associated header file. Dependencies between modules are minimized and

implemented at the application level. This allows for easy porting of application code from one device to another –

only the hardware-dependent module configurations must be adjusted. The acquisition auto-tune and acquisition

manual tune modules have the same API file. All the other modules have their API file that needs to be linked to the

user application.

5.4.2 and filesTouch.c Touch.h

User options for each module are configured in application code, typically and , and shared withtouch.h touch.c

the library module by pointer reference. Similarly, arrays are created in application code for modules’ run-time data

and provided to the module via a pointer.

Configurations may be modified on-the-fly by application code in between measurement sweeps of the touch

sensors. All run-time data is available to the application code.

5.4.3 Common_components_api.h

The application requires structures and definitions common to all modules. The common definitions, macros, and the

data structures are placed in the file .“ ”qtm_common_components_api.h

5.4.4 Touch_api_ptc.h

This file contains all the module API files included in the content, and thus this single file is sufficient to be included

on the application source files wherever necessary.

User's Guide

QTouch® Modular Library

5.4.5 Module Reburst Flag

Module configuration and functionality are unique to each module, but any module may require a repeated

measurement of specific sensors. To achieve this, a signal conditioning module may temporarily change the

acquisition configuration, e.g., to disable those sensors not requiring reburst.

This is indicated to the application by the implementation of a common byte at the first location of the signal‘Status’

conditioning group data structure. A ‘ ’ in bit 7 indicates that the application should re-start measurement on the1

sensor group without waiting for the measurement cycle time-out.

Figure 5-1. uint8_t qtm_xxx_status

Bit 7

Bit 6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

Bit 0

Re-burst

Module specific status flags

5.4.6 Binding Layer Module

The binding layer module provides an easy interface of QTouch modules to the user application. The binding layer

binds all the configured modules in the appropriate sequence using minimal API functions. It takes care of the

initialization of modules, synchronizes the calling procedures, and handles the error statuses.

5.5 Application Flow

5.6 MISRA Compliance

QTouch Library modules source code is compliant with the rule set of MISRA 2004, with the following‘Required’

exceptions:

User's Guide

QTouch® Modular Library

Table 5-2. AVR® MCU Acquisition Modules and Exceptions

Acquisition Modules of ATmega32xPB, ATtiny81x, ATtiny161x, ATtiny321x Devices

MISRA Rule Definition Remarks

1.1

All code shall conform to ISO 9899:1990 Programming

languages – C, amended and corrected by ISO/IEC

9899/COR1:1995, ISO/IEC 9899/AMD1:1995, and

ISO/IEC 9899/COR2:1996

The compiler is configured to allow

extensions

8.5 There shall be no definitions of objects or functions in

a header file Inline functions are used in the header files

17.4 Array indexing shall be the only allowed form of

pointer arithmetic

The pointer of module data structures is

passed as a parameter and individual object

data are fetched by iterating the data

structure as an array index

Table 5-3. AVR® Postprocessing Modules and Exceptions

Touch_key, Binding Layer, Frequency Hop Auto Tune, Frequency Hop, Scroller, 2D Touch Surface and

Gesture

MISRA Rule Definition Remarks

17.4 Array indexing shall be the only allowed

form of pointer arithmetic

The pointer of module data structures is passed as a

parameter and individual object data are fetched by

iterating the data structure as an array index

Table 5-4. Arm® Acquisition Modules and Postprocessing Modules

Modules

MISRA Rule Definition Remarks

1.1

All code shall conform to ISO 9899:1990

Programming languages – C, amended and corrected

by ISO/IEC 9899/COR1:1995, ISO/IEC 9899/

AMD1:1995, and ISO/IEC 9899/COR2:1996

The compiler is configured to allow

extensions

17.4 Array indexing shall be the only allowed form of

pointer arithmetic

The pointer of module data structures is

passed as a parameter and individual object

data are fetched by iterating the data

structure as an array index

User's Guide

QTouch® Modular Library

6. Acquisition Module

6.1 Overview

The minimum requirement for a touch sensor application is an acquisition module, which implements all hardware-

dependent operations for configuration and measurement of capacitive touch or proximity sensors.

6.2 Interface

The data structure definitions and the API declarations are included in the API file

“ ”. The data structure covers all the configurations and output dataqtm_acq_<device_id>_<module_id>_api.h

variables. This file should be included on the common API ‘ ’ file.touch_ptc_api.h

User

Application

Touch.h

Macros and

constants

Qtm_acq_<device_i

d>_<Module_id>_a

pi.h

Touch_api_ptc

Acquisition

Module

common_

components_api.h

Touch.c

Global variables declaration

and initialization, Helper API

functions

6.3 Functional Description

Acquisition modules are target specific, each having a hardware configuration structure depending on the touch

sensing technology and method applied.

User's Guide

Acquisition Module

Features Implemented in this Acquisition Module

• Hardware Calibration for Sensor Nodes

– Calibration of Prescaler/Resistor/Charge share delay to compensate for a time constant of sensor

electrodes

– Calibration of internal compensation circuit to match sensor load

• Self-Capacitance and Mutual Capacitance Sensor Touch Measurement with Normal Sequencing

• Low-Power Mode of Automated Scanning Using Event System (Currently not Supported on Atmel Start

Configurator)

6.4 Configuration

6.4.1 Data Structures

The acquisition module implements all functionality required for making relative measurements of sensor

capacitance. This is the only module uniquely built for an individual device, as it must access and control the pins

used for touch sensor implementation.

As devices have different hardware features available, different configuration options are available on each device.

For the most efficient use of system resources – ROM and RAM – different sensor configuration structures are

required.

However, where the same variable name is used within the structure, the functionality controlled by that variable is

identical. Any dependent function should utilize a reference to the variable, and NOT rely on a reference to the

structure and pointer arithmetic.

User's Guide

Acquisition Module

Acquisition Group Configuration

A reference by a pointer to ‘ ’ will always point to the correct&ptc_qtlib_acq_gen1.freq_option_select

memory location, regardless of the device. However, any implementation based on pointer arithmetic will require re-

factoring if code is to be re-used from one device for another.

Parameter Size Range/Options Usage

num_sensor_nodes 16-bit 0 to 65535 The number of sensor nodes configured in the group

acq_sensor_type 8-bit

NODE_SELFCAP

NODE_MUTUAL

Defines the measurement method applied to this group of

nodes

calib_option_select 1 byte

Bits 3:0

Calibration type:

CAL_AUTO_TUNE_NONE

CAL_AUTO_TUNE_RSEL

CAL_AUTO_TUNE_PRSC

CAL_AUTO_TUNE_CSD*

The calibration type selects which parameter should be

automatically tuned for optimal charge transfer

Bits 7:4

Calibration target:

CAL_CHRG_2TAU

CAL_CHRG_3TAU

CAL_CHRG_4TAU

CAL_CHRG_5TAU

The calibration target applies a limit to the charge transfer

loss allowed, where a higher setting of a target ensures a

greater proportion of full charge is transferred

freq_option_select 1 byte FREQ_SEL_0 FREQ_SEL_15 to

Or FREQ_SEL_SPREAD

FREQ_SEL_0 FREQ_SEL_15 to inserts a delay cycle

between measurements during oversampling, where 0 is

the shortest delay, 15 the longest.

FREQ_SEL_SPREAD varies this delay from 0 to 15 in a

sawtooth manner during the oversampling set.

PTC_interrupt_priority** 1 byte 1 to 3 Interrupt priority level for the PTC

Note: * - Not available on all devices.

** - Applicable for Arm® Cortex devices only.

Node Configuration

Similarly, node configuration structures vary depending on which device is used.

• Number of X lines

• Number of Y lines

• Feature availability

User's Guide

Acquisition Module

Parameter Size Range/Options Usage

node_xmask 1/2/4/8 bytes (Bit field)

Set the bit(s) at location(s)

corresponding to X line

number(s).

Example:

X0 only = = 0x010b00000001

X0 and X2 = =0b00000101

0x05

1 byte is used for devices with

up to 8 “X” lines.

2 bytes, 4 bytes, 8 bytes are

used for devices up to 16, 32

and 46* “X” lines, respectively.

Note:

*Can support up to 64 X lines.

node_ymask 1/2/4/8 bytes (Bit field)

Set the bit(s) at location(s)

corresponding to Y line

number(s).

Example:

Y5 only = = 0x200b00100000

Y1, Y2 and Y7 = 0b10000110

= 0x86

1 byte is used for devices with

up to 8 “Y” lines

2 bytes, 4 bytes, 8 bytes are

used for devices up to 16, 32,

and 46 “Y” lines, respectively.*

Note:

*Can support up to 64 Y lines.

node_csd*1 byte 0 to 255

The number of delay cycles to

ensure charging of sensor node

capacitances.

(Applicable for AVR® ATtiny,

ATmega, Arm® SAM E54,

SAMCx, SAM L22 family only.)

User's Guide

Acquisition Module

...........continued

Parameter Size Range/Options Usage

node_rsel_prsc 1 byte

Bits 7:4 = RSEL

RSEL_VAL_0

RSEL_VAL_3*

RSEL_VAL_6*

RSEL_VAL_20

RSEL_VAL_50

RSEL_VAL_70*

RSEL_VAL_75*

RSEL_VAL_80*

RSEL_VAL_100

RSEL_VAL_120*

RSEL_VAL_200*

Internal Y line series resistor

selection.

* May not be available for all

devices.

SAM E5x, SAM D5x: 3 kΩ, 6

kΩ, 75 kΩ, 200 kΩ

SAM L22: 75 kΩ, 200 kΩ

AVR-DA: 70 kΩ, 80 kΩ, 120 kΩ,

200 kΩ

Bits 3:0 = PRSC

PRSC_DIV_SEL_1

PRSC_DIV_SEL_2

PRSC_DIV_SEL_4

PRSC_DIV_SEL_6*

PRSC_DIV_SEL_8

PRSC_DIV_SEL_12*

PRSC_DIV_SEL_14*

PRSC_DIV_SEL_16*

PRSC_DIV_SEL_32*

PRSC_DIV_SEL_64 *

PRSC_DIV_SEL_128*

Clock Prescaler

The acquisition clock is derived

and scaled from CPU clock for

AVR® devices.

*May not be available for all

devices.

SAM E5x, SAM D5x, ATtiny: 16

kΩ, 32 kΩ, 64 kΩ, 128 kΩ

AVR-DA: 6, 12, 14 **

**The numbers correspond to

the prescaler value.

node_gain 1 byte

Bits 7:4 = Analog Gain

GAIN_1

GAIN_2

GAIN_4

GAIN_8

GAIN_16

Analog Gain Setting

Integration capacitor adjusted

to control integrator gain.

Bits 3:0 = Digital Gain

GAIN_1

GAIN_2

GAIN_4

GAIN_8

GAIN_16

Digital Gain Setting

The accumulated sum is scaled

to digital gain.

User's Guide

Acquisition Module

...........continued

Parameter Size Range/Options Usage

node_oversampling 1 byte

FILTER_LEVEL_1

FILTER_LEVEL_2

FILTER_LEVEL_4

FILTER_LEVEL_8

FILTER_LEVEL_16

FILTER_LEVEL_32

FILTER_LEVEL_64

FILTER_LEVEL_128*

FILTER_LEVEL_256*

FILTER_LEVEL_512*

FILTER_LEVEL_1024*

The number of samples to

accumulate for each

measurement.

Note: Oversampling must be

configured to be greater than or

equal to digital gain for correct

operation.

(Higher filter level values > 64

are available only on Arm®

SAM E54 family only.)

Note: * - Not available on all devices.

6.4.2 Status and Output Data

While different target hardware requires that the configuration structure for sensor nodes varies from one device to

another, all acquisition modules conform to a standard sensor node data structure. Processed module output data

are stored in this data structure during run-time.

The outputs/status information may be used by other post-processing modules or by the application.

Parameter Size Range/Options Usage

node_acq_status 1 byte

Bit 7 Indicates node calibration error

NODE_CAL_ERROR

Bit 6 Rise Time calibration complete

Bit 5 -

Bit <4:2> (three bits)

Node calibration state

NODE_MEASURE

NODE_CC_CAL

NODE_PRSC_CAL

NODE_RSEL_CAL

NODE_CSD_CAL

Indicates whether a calibration is ongoing and its current

stage

Calibration Request Write to ‘ ’ to trigger calibration sequence on this node.1

(Reset to ‘ ’ by module once actioned.)0

Enabled Write to ‘ ’ to enable this node for measurement1

node_acq_signals 2 bytes Most recent measurement for this

sensor node.

16-bit unsigned value

Accumulated and scaled as per andnode_oversampling

node_gain_digital settings.

node_comp_caps 2 bytes Hardware calibration data Indicates the tuning of the compensation circuit for this node

User's Guide

Acquisition Module

Table 6-1. node_acq_status

Bit 7 6 5 4 3 2 1 0

Node

Calibration

Error

Rise time

calibration

complete

- Node State Calibrate

request Enabled

NODE_MEASURE 0

NODE_CC_CAL 1

NODE_PRSC_CAL 2

NODE_RSEL_CAL 3

NODE_CSD_CAL* 4

Note: * - CSD calibration is not available on SAM D10/D11, SAM D2x, SAM L21 devices.

Acquisition Library State

Table 6-2. touch_lib_state_t

TOUCH_STATE_NULL 0

TOUCH_STATE_INIT 1

TOUCH_STATE_READY 2

TOUCH_STATE_CALIBRATE 3

TOUCH_STATE_BUSY 4

Return Parameter

Table 6-3. Common Return Type, Used by All QTML Modulestouch_ret_t

TOUCH_SUCCESS 0

TOUCH_ACQ_INCOMPLETE 1

TOUCH_INVALID_INPUT_PARAM 2

TOUCH_INVALID_LIB_STATE 3

TOUCH_INVALID_POINTER 11

TOUCH_LIB_NODE_CAL_ERROR 14

Note: Other values are reserved for future use.

User's Guide

Acquisition Module

7.2.1 Sensor Node Group

qtm_acquisition_control_t

• A top-level container for an acquisition group

• Contains pointers to group and node memory containing configurations and run-time data

Structure Contents

qtm_acquisition_control_t qtm_acq_node_group_config_t

(*qtm_acq_node_group_config);

qtm_acq_4p_saml10_config_t

(*qtm_acq_node_config);

qtm_acq_node_data_t (*qtm_acq_node_data);

qtm_acq_node_group_config_t

• Common parameters, applied to all sensor nodes in the group

Parameter Size Range/Options Usage

num_sensor_nodes 16-bit 4 to 65532 The total number of sensor nodes

configured in the group, for example,

a number of 4P sets X4.

acq_sensor_type 8-bit NODE_MUTUAL_4P Parallel sets of 4 mutual capacitance

sensor nodes. Each set contains 4x

PTC X masks and 1x PTC Y masks

for the measurement of XY

capacitance.

calib_option_select 1 byte Bits 3:0 Calibration type Selects which parameter is auto-

tuned for charge transfer.

CAL_AUTO_TUNE_NONE No auto-tune for charge transfer

CAL_AUTO_TUNE_RSEL Series resistor tuned to the largest

value that allows full charge transfer

CAL_AUTO_TUNE_PRSC Prescaler tuned to the lowest

(fastest) value that allows full charge

transfer

CAL_AUTO_TUNE_CSD Charge share delay tuned to the

lowest value that allows full charge

transfer

Bits 7:4 Calibration target Target charge time for sensor

capacitance.

CAL_CHRG_2TAU Sensor charged for 2 x Time

constant

CAL_CHRG_3TAU Sensor charged for 3 x Time

constant

CAL_CHRG_4TAU Sensor charged for 4 x Time

constant

CAL_CHRG_5TAU Sensor charged for 5 x Time

constant

User's Guide

Boost Mode

...........continued

Parameter Size Range/Options Usage

freq_option_select 1 byte FREQ_SEL_0

FREQ_SEL_15

FREQ_SEL_0 FREQ_SEL_15 to

inserts a delay cycle between

measurements during oversampling,

where 0 is the shortest delay, 15 the

longest

FREQ_SEL_SPREAD FREQ_SEL_SPREAD varies this delay

from 0 to 15 in a sawtooth manner

during the oversampling set

ptc_interrupt_priority 1 byte 1 to 3 Arm® NVIC Interrupt priority

qtm_acq_saml10_node_config_t

Note: This data structure is the specific configuration for SAM L10 PTC hardware.

Parameter Size Range/Options Usage

node_xmask[4] 4x4 bytes

(16 bytes)

4x8*

bytes (32

bytes)

*AVR-DA

Array/bit field Select X pin masks for

NODE_MUTUAL_4P.

Set the bit(s) at location(s)

corresponding to X line number(s).

For example:

X0 only = = X00b00000001 0x01

and X2 = = 0b00000101 0x05

node_ymask 4 bytes

8* bytes

*AVR-DA

(bit field) Select Y pin mask.

Set the bit(s) at location(s)

corresponding to Y line number(s).

For example:

Y5 only = = 0b00100000 0x20

Y1, Y2 and Y7 = = 0b10000110 0x86

node_csd 1 byte For SAM L1x:

0 to 255

For ATtiny81x,161x,

321x:

0 to 31

The number of delay cycles to ensure

the charging of the sensor node

capacitances

Note: If auto-tune is enabled, this

value is used for initial compensation

capacitor calibration. Ensure it allows

sufficient time to charge the sensor.

User's Guide

Boost Mode

...........continued

Parameter Size Range/Options Usage

node_rsel_prsc 1 byte Bits 7:4 = RSEL

RSEL_VAL_0

RSEL_VAL_20

RSEL_VAL_50

RSEL_VAL_70*

RSEL_VAL_80*

RSEL_VAL_100

RSEL_VAL_120*

RSEL_VAL_200

Internal Y line series resistor selection

* May not be available for all devices

AVR-DA: 70 kΩ, 80 kΩ, 120 kΩ, 200

kΩ

Bits 3:0 = PRSC

PRSC_DIV_SEL_1

PRSC_DIV_SEL_2

PRSC_DIV_SEL_4

PRSC_DIV_SEL_6*

PRSC_DIV_SEL_8

PRSC_DIV_SEL_12*

PRSC_DIV_SEL_14*

PRSC_DIV_SEL_16

Clock Prescaler

Acquisition clock is derived and scaled

from CPU clock for AVR® devices.

* May not be available for all devices.

AVR-DA: 6 , 12, 14 **

**The numbers correspond to the

prescaler value.

node_gain 1 byte Bits 7:4 = Analog Gain

GAIN_1

GAIN_2

GAIN_4

GAIN_8

GAIN_16

Analog Gain Setting

Integration capacitor adjusted to

control integrator gain.

Bits 3:0 = Digital Gain

GAIN_1

GAIN_2

GAIN_4

GAIN_8

GAIN_16

Digital Gain Setting

The accumulated sum is scaled to

Digital Gain.

User's Guide

Boost Mode

•libqtm_acq_4p_saml1x_0x0033.a

•qtm_acq_4p_saml1x_0x0033.a

ATtiny161x Modules:

•libqtm_acq_4p_t161x_0x001b.a

•qtm_acq_4p_t161x_0x001b.r90

ATtiny321x Modules:

•libqtm_acq_4p_t321x_0x001b.a

•qtm_acq_4p_t321x_0x001b.r90

AVR-DA Modules:

•libqtm_acq_4p_avr_da_0x0038.a

•qtm_acq_4p_avr_da_0x0038.r90

User's Guide

Boost Mode

8. Frequency Hop Module

8.1 Overview

The Frequency Hop module provides a way of filtering the noise during the sensor measurement by varying the

frequency of bursting the sensors. Module ID for frequency hop module is 0x0006 and the module name is in the

format given below.

GCC compiler libqtm_freq_hop_xxxxx_0x0006.a

IAR compiler (AVR® MCU) qtm_freq_hop_xxxxx_0x0006.r90

IAR compiler (Arm® MCU) qtm_freq_hop_xxxxx_0x0006.a

Note: “xxxxx” – string based on the device architecture that the module is built.

8.2 Interface

The data structure definitions and the API declarations are included in the API file

‘ ’. The data structure covers all the configurations and output data variables. Thisqtm_freq_hop_0x0006_api.h

file should be included on the common API ‘ ’ file.touch_ptc_api.h

User

Application

Touch.h

Macros and

constants

Qtm_freq_hop_

0x0006_api.h

Touch_api_

ptc.h

Frequency

Hop Module

common_

components_api.h

Touch.c

Global variables declaration

and initialization, Helper

API functions

The default values of configurations should be defined on the and files. Global variables of thetouch.c touch.h

data structures have to be initialized in the file, and the reference of the structure has to be used on thetouch.c

application files.

User's Guide

Frequency Hop Module

8.3 Functional Description

The Frequency Hop module is interfaced between the Acquisition module and the rest of the post-processing

modules, as shown below.

Frequency Hop

Auto-Tune

Module

The Frequency Hop module applies a configurable cyclic frequency hopping algorithm, such that on each

measurement cycle a different sampling frequency is used. The module is initialized with predefined frequencies,

which are set by cyclic order during the consecutive measurement cycles.

The measured raw signal values from the acquisition module are then passed through . Finally, the“Median filter”

filtered value is stored back on the memory for further processing by the post-processing modules.

A number of frequencies provides effective filtering by processing more samples. However, this also increases the

buffer size used by the median filter and takes a number of measurement cycles to report filtered value. So, the

number of frequencies should be configured based on the RAM memory available.

8.4 Configuration

User's Guide

Frequency Hop Module

8.4.1 Data Structures

Parameter Size Range/Options Usage

num_sensors 1 byte 0-255 The number of sensors to

buffer data for median filter

num_freqs 1 byte 3-to-7

The number of frequencies

to cycle/depth of median

filter

*freq_option_select 2/4 bytes N/A

The pointer to the

acquisition library

frequency selection

parameter

*median_filter_freq 2/4 bytes N/A The pointer to the array of

selected frequencies

8.4.2 Status and Output Data

Parameter Size Range/Options Usage

module_status 1 byte N/A Module status – N/A

current_freq 1 byte 0-to-15 Current frequency step

*filter_buffer 2/4 bytes N/A

The pointer to the filter

buffer array for measured

signals

*qtm_acq_node_data 2/4 bytes N/A

The pointer to the node

data structure of the

acquisition group

Table 8-1. List of Supported Frequencies

PTC Clock = 4 MHz

PTC Frequency Delay Cycles Frequency [kHz]

0FREQ_SEL_0 66.67

1FREQ_SEL_1 62.5

2FREQ_SEL_2 58.82

3FREQ_SEL_3 55.56

4FREQ_SEL_4 52.63

5FREQ_SEL_5 50

6FREQ_SEL_6 47.62

7FREQ_SEL_7 45.45

8FREQ_SEL_8 43.48

9FREQ_SEL_9 41.67

10 FREQ_SEL_10 40

11 FREQ_SEL_11 38.46

12 FREQ_SEL_12 37.04

User's Guide

Frequency Hop Module

...........continued

PTC Clock = 4 MHz

PTC Frequency Delay Cycles Frequency [kHz]

13 FREQ_SEL_13 35.71

14 FREQ_SEL_14 34.48

15 FREQ_SEL_15 33.33

16 FREQ_SEL_SPREAD Variable frequencies

User's Guide

Frequency Hop Module

9. Frequency Hop Auto-Tune Module

9.1 Overview

The frequency hop auto-tune module is the superset of the frequency hop module with additionally providing noise

monitoring and tuning the frequency according to the measured noise factor.

The Module ID for the frequency hop auto-tune module is ‘0x0004’, and the module name is in the format given

below.

GCC compiler libqtm_freq_hop_auto_xxxxx_0x0004.a

IAR compiler (AVR® MCU) qtm_freq_hop_auto_xxxxx_0x0004.r90

IAR compiler (Arm® MCU) qtm_freq_hop_auto_xxxxx_0x0004.a

Note: “xxxxx” – string based on the device architecture that the module is built.

9.2 Interface

The data structure definitions and the API declarations are included in the API file

‘ ’. The data structure covers all the configurations and output data variables.qtm_freq_hop_auto_0x0004_api.h

This file should be included on the common API file.touch_ptc_api.h

User's Guide

Frequency Hop Auto-Tune Module

User

Application

Touch.h

Macros and

constants

Qtm_freq_ho

p_auto_0x00

04_api.h

Touch_api_

ptc.h

Frequency

Hop Auto

-tune Module

common_

components_api.h

Touch.c

Global variables declaration

and initialization, Helper API

functions

The default values of the configurations should be defined on the and files. Global variables oftouch.c touch.h

the data structures have to be initialized in the file, and the reference of the structure has to be used on thetouch.c

application files.

9.3 Functional Description

The frequency hop auto-tune module is interfaced between the acquisition module and the rest of the post-

processing modules, as shown below.

User's Guide

Frequency Hop Auto-Tune Module

Frequency Hop

Auto-Tune

Module

The frequency hop auto-tune module applies a configurable cyclic frequency-hopping algorithm, such that on each

measurement cycle a different sampling frequency is used. Several preconfigured frequencies are implemented in

turn during consecutive measurement cycles.

Where ‘n’ frequencies are included in the cycle, an ‘n’-point median filter is applied to the output data.

To perform auto-tuning, the signals measured on each sensor node are recorded for each selected frequency. When

one frequency shows greater variance than the others, that frequency is removed from the measurement sequence

and replaced with another.

9.4 Configuration

9.4.1 Data Structures

Parameter Size Range/

Options Usage

num_sensors 1 byte 0 – 255 The number of sensors to buffer data for the median

filter

num_freqs 1 byte 3-to-7 The number of frequencies to cycle/depth of the

median filter

User's Guide

Frequency Hop Auto-Tune Module

...........continued

Parameter Size Range/

Options Usage

*freq_option_select Pointer 2/4

bytes Pointer The pointer to the acquisition library frequency

selection parameter

*median_filter_freq Pointer 2/4

bytes Pointer The pointer to the array of selected frequencies

enable_freq_autotune 1 byte 0 or 1 Disable ( ) or enable ( ) automatic retuning of hop0 1

frequencies

max_variance_limit 1 byte 1-to-255 Signal variance required to trigger returning of hop

frequency

Autotune_count_in 1 byte 1-to-255

The number of occurrences of

max_variance_limit to trigger retuning of hop

frequency

9.4.2 Status and Output Data

Parameter Size Range/Options Usage

module_status 1 byte N/A Module status – N/A

current_freq 1 byte 0-to-15 Current frequency step

*filter_buffer Pointer 2/4 bytes Pointer The pointer to the filter buffer array for measured

signals

*qtm_acq_node_data Pointer 2/4 bytes Pointer The pointer to the node data structure of the

acquisition group

*freq_tune_count_ins Pointer 2/4 bytes Pointer Pointing to the counter array to trigger frequency

change

User's Guide

Frequency Hop Auto-Tune Module

User

Application

Touch.h

Macros and

constants

Qtm_touch_key

_0x0002_api.h

Touch_api_

ptc.h

Touch Key

Module

common_

components_api.h

Touch.c

Global variables declaration

and initialization, Helper API

functions

10.3 Functional Description

The touch key module is responsible for the detection of a touch contact, where higher-level module(s) carry out

position interpolation, gesture recognition, contact tracking, etc.

Features implemented in the touch key module:

• Timing Management for Detecting Towards Touch, Away from Touch

• Software Calibration

– Reference signal

– Reference drift

• Touch Detection State Machine

User's Guide

Touch Key Module

10.4 Configuration

10.4.1 Data Structures

Table 10-2. Group Configuration

Parameter Size Range/Options Usage

num_key_sensors 2 bytes 1-to-65535 The number of sensor keys in the group

sensor_touch_di 1 byte 0-to-255

The number of repeat measurements to

confirm touch detection and out-of-touch

detection

sensor_max_on_time 1 byte 0 (Disabled), 1-

to-255

The number of timer periods with sensor In

Detect before automatic ‘recal’

sensor_anti_touch_di 1 byte 0 (Disabled), 1-

to-255

The number of repeat measurements to

confirm anti-touch recalibration required

sensor_anti_touch_recal_thr 1 byte 0-to-5

Scale-down of touch threshold to set anti-

touch threshold.

0 = 100% Touch Threshold

1 = 50%

2 = 25%

3 = 12.5%

4 = 6.25%

5 = Maximum Recalibration

sensor_touch_drift_rate 1 byte 0 (Disabled), 1-

to-255

The number of timer periods to countdown

between towards touch drifts

User's Guide

Touch Key Module

...........continued

Parameter Size Range/Options Usage

sensor_anti_touch_drift_rate 1 byte 0 (Disabled), 1-

to-255

The number of timer periods to countdown

between away from touch drifts

sensor_drift_hold_time 1 byte 0 (Disabled), 1-

to-255

The number of timer periods to stop drifting

after touch event

sensor_reburst_mode 1 byte

0 = None

1 = Unresolved

(Quick reburst)

2 = All

None – Reburst is never set, measurements

according to application schedule.

Unresolved – Reburst is set, all sensors

suspended except those in same AKS as

the target sensor.

All – Reburst is set, no sensors are

suspended.

Table 10-3. Individual Sensor Configuration

Parameter Size Range/Options Usage

channel_threshold 1 byte 0-to-255 Minimum signal delta indicating touch contact

channel_hysteresis 1 byte 0 (50%)-to-4 (3.125%) Reduction of touch threshold to de-bounce when filtering

out removed touch contact

channel_aks_group 1 byte 0-to-255 Grouping of key sensors controlling simultaneous touch

detect.

10.4.2 Status and Output Data

Table 10-4. Group Data

Parameter Size Range/Options Usage

qtm_keys_status 1 byte

Bit 7: Reburst required

Bit 6-1: Reserved

Bit 0: Touch Detection

Indicates the current state of

the Touch Key Group

acq_group_timestamp 2 bytes 0-to-65535 Timestamp of last drift period

processed

dht_count_in 1 byte 0-to-‘ ’sensor_drift_hold_time Countdown to drift hold

release after a touch event

tch_drift_count_in 1 byte 0-to-‘ ’sensor_touch_drift_rate Countdown to next towards a

touch drift period

antitch_drift_count_in 1 byte 0-to-‘ ’sensor_anti_touch_drift_rate Countdown to the next away

from a touch drift period

Individual Key Sensor Data

The individual key sensor data is required by other post processing modules like Scroller. So, this data structure

definition is placed on the file.common_compoenents_api.h

Parameter Size Range/Options Usage

sensor_state 1 byte Bit field Touch key sensor state

sensor_state_counter 1 byte 0-to-255 The number of repeat measurements to confirm a touch

detection and an out-of-touch detection

User's Guide

Touch Key Module

Produktspezifikationen

Marke:	Microchip
Kategorie:	Nicht kategorisiert
Modell:	ATSAMC21G18A

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