Intel 540s Bedienungsanleitung

Intel Solid-State-Laufwerke (SSD) 540s

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Order Number: 334047-001US

Intel® Solid State Drive 540s Series (M.2)

Product Specification

Capacities: , 180, 2 , 360, 480, 1000 GB 120 40

Form Factors:

 80mm (single-sided) 2280- -B- S3 M

(120, 180, 2 , 360, 480 ) 40 GB

 80mm (double-sided) 2280-D3-B-M (1000 G B)

Thickness: up to 2.38 ; D3 up to 3.73mm S3 –mm –

Weight: <7 grams

SATA 6Gb/s Bandwidth Performance1,2

(IOMeter* Queue Depth 32)

 Sequential Read: up to 560MB/s

 Sequential Write: up to 480MB/s

Read and Write IOPS1,2

(IOMeter Queue Depth 32)

 Random 4KB Reads: up to ,000 IOPS 78

 Random 4KB Writes: up to 85,000 IOPS

Additional Compatibility

 Intel® SSD Toolbox with Intel® SSD Optimizer

 Intel® Data Migration Software

 Intel® Rapid Storage Technology

 SATA Revision 3.2

 ACS-3 (ATA/ATAPI Command Set 3)

 SSD Enhanced SMART ATA feature set

AES 256-bit Encryption

Power Management

 3.3 V SATA Supply Rail

 SATA Link Power Management (LPM)

 Device Sleep (DevSleep)

 Advanced Power Management (APM)

Power

 Active (BAPCo MobileMark* 20 Workload): 12

80 mW

 Idle3: 40 mW

 DevSleep: 3 mW

Temperature

 Operating4: 0° C to 70° C

 Non-Operating: - ° C to 95° C 55

Reliability

 Uncorrectable Bit Error Rate (UBER):

<1 sector per 1016 bits read

 Mean Time Between Failure (MTBF):

1.6 million hours

 Shock (non-operating):

1,000 G/0.5 ms

Vibration

 Operating: 2.17 GRMS (5-700Hz)

 N -operating: 3.13 GRMS (5-800Hz) on

Certifications and Declarations:

 UL*

 CE*

 RCM*

 BSMI*

 KCC*

 Microsoft* WHCK/WHLK

 VCCI*

 SATA-IO*

Product Ecological Compliance

 RoHS*

NOTES:

1. IOMeter Test and System Configurations: -4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard, Intel® Core™ i7

Intel® HD Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB)

Kingston DDR3-1555,

Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.

2. Performance values vary by capacity.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper

device operating temperatures on heavier workloads.

Intel® Solid State Drive 540s Series (M.2)

Product Specification March 2016

2 334047- 1US 00

Ordering Information

Contact your local Intel sales representative for ordering information.

Revision History

Revision Number

Description

Revision Date

001

 Initial release

March 2016

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will

affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.

For more complete information about performance and benchmark results, visit http://www.intel.com/performance.

IOMeter Test and System Configurations: -4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard, Intel® HD Intel® Core™ i7

Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB) Kingston DD -1555, R3

Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.

All documented test results are obtained by Intel in compliance with JESD218 Standards; refer to individual sub-sections within this document

for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.

Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well

as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements.

The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular

purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from

published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document

contains information on products in the design phase of development.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling

1-800-548-4725, or go to : http://www.intel.com/design/literature.htm

Intel, Intel Core i7-4790, Intel HD Graphics 4600 Driver, Intel INF, Intel RST and the Intel logo are trademarks of Intel Corporation in the U.S.

and other countries.

*Other names and brands may be claimed as the property of others.

Intel® Solid State Drive 540s Series (M.2)

March 2016 Product Specification

3340 - 1US 3 47 00

Contents

1 Introduction .......................................................................................................................................................................................................... 5

1.1 Terminology ............................................................................................................................................................................................... 5

1.2 Reference Documents ........................................................................................................................................................................... 6

2 Product Specifications ..................................................................................................................................................................................... 7

2.1 Capacity ........................................................................................................................................................................................................ 7

2.2 Performance ............................................................................................................................................................................................... 7

2.3 Electrical Characteristics ...................................................................................................................................................................... 8

2.4 Environmental Conditions ................................................................................................................................................................... 9

2.4.1 Temperature, Shock, Vibration ......................................................................................................................................... 9

2.4.2 Altitude ......................................................................................................................................................................................... 9

2 Product Regulatory Compliance .5 ....................................................................................................................................................... 9

2.6 Reliability ................................................................................................................................................................................................... 10

3 Mechanical Information ................................................................................................................................................................................ 11

4 Pin and Signal Descriptions ........................................................................................................................................................................ 13

4.1 Pin Locations ............................................................................................................................................................................................ 13

4.2 Signal Descriptions ............................................................................................................................................................................... 14

5 Supported Command and Feature Sets ............................................................................................................................................... 16

5.1 Supported ATA General Feature Command Set ..................................................................................................................... 16

5.2 Security Features ................................................................................................................................................................................... 18

5.2.1 Sanitization Methods ........................................................................................................................................................ 18

5.3 DevSleep .................................................................................................................................................................................................... 18

5.4 SMART Attributes .................................................................................................................................................................................. 19

6 Certifications and Declarations ................................................................................................................................................................. 22

7 Appendix ............................................................................................................................................................................................................... 23

7.1 Identify Device ......................................................................................................................................................................................... 23

7.2 Models .........................................................................................................................................................................................................26