HP ProLiant DL80 G9 Bedienungsanleitung

HP Server ProLiant DL80 G9

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HPE ProLiant DL80 Gen9 Server
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware
components and software. This guide is for an experienced
service technician. Hewlett Packard Enterprise assumes that you are qualified
in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Part Number: 785385- 003
April 2016
Edition: 4
© Copyright 2014, 2016 Hewlett Packard Enterprise Development LP
The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services
are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting
an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.
Intel® and Xeon® are trademarks of Intel Corporation in the U.S. and other countries.
Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.
Microsoft® and Windows® are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.
microSD is a trademark or a registered trademark of SD-3C in the United States, other countries or both.
Contents 3
Contents
Customer self repair.................................................................................................................................. 6
Parts only warranty service ...................................................................................................................................... 6
Illustrated parts catalog ........................................................................................................................... 16
Mechanical components ......................................................................................................................................... 16
System components ............................................................................................................................................... 18
Removal and replacement procedures ................................................................................................... 24
Required tools ........................................................................................................................................................ 24
Safety considerations ............................................................................................................................................. 24
Preventing electrostatic discharge............................................................................................................... 24
Symbols on equipment ................................................................................................................................ 24
Server warnings and cautions ..................................................................................................................... 25
Rack warnings ............................................................................................................................................. 25
Preparation procedures .......................................................................................................................................... 26
Remove the security bezel (optional) .......................................................................................................... 27
Power down the server ................................................................................................................................ 27
Extend the server from the rack .................................................................................................................. 27
Access the product rear panel ..................................................................................................................... 30
Remove the server from the rack ................................................................................................................ 30
Remove the PCI riser cages........................................................................................................................ 31
Non- - hot plug drive carrier....................................................................................................................................... 32
Non- - hot plug drive.................................................................................................................................................. 33
Hot- plug drive blank ............................................................................................................................................... 34
Hot- plug drive ......................................................................................................................................................... 34
Access panel .......................................................................................................................................................... 35
Air baffle ................................................................................................................................................................. 36
4- - - bay LFF non hot plug drive backplane................................................................................................................ 37
4- - bay LFF hot plug drive backplane....................................................................................................................... 38
Smart Storage Battery ............................................................................................................................................ 39
Smart Storage Battery retainer ............................................................................................................................... 40
FBWC module ........................................................................................................................................................ 41
M.2 SSD enablement kit ......................................................................................................................................... 42
Fan blank ................................................................................................................................................................ 44
Hot- swap fan .......................................................................................................................................................... 45
DIMMs .................................................................................................................................................................... 46
Memory- processor compatibility information............................................................................................... 46
Removing the DIMM .................................................................................................................................... 46
Processor blank ...................................................................................................................................................... 47
Heatsink ................................................................................................................................................................ . 48
Processor ............................................................................................................................................................... 50
Expansion board .................................................................................................................................................... 54
Primary PCI riser cage blank .................................................................................................................................. 56
Onboard low profile PCI expansion slot cover- ....................................................................................................... 58
Primary PCI riser cage ........................................................................................................................................... 58
FlexibleLOM riser cage .......................................................................................................................................... 59
GPU riser board ..................................................................................................................................................... 59
Two- slot PCIe riser board....................................................................................................................................... 60
FlexibleLOM riser board ......................................................................................................................................... 61
System battery ....................................................................................................................................................... 62
Front I/O assembly ................................................................................................................................................. 63
Thumbscrew rack ears ........................................................................................................................................... 65
Quick ..................................................................................................................- release latch rack ear assembly 66
System board ......................................................................................................................................................... 69
HPE 550 W Power Supply ..................................................................................................................................... 76


Produktspezifikationen

Marke: HP
Kategorie: Server
Modell: ProLiant DL80 G9
Installiertes Betriebssystem: Nein
Prozessorhersteller: Intel
Anzahl Prozessorkerne: 6
Breite: 434.7 mm
Tiefe: 634.3 mm
Gewicht: 27000 g
Höhe: 87.6 mm
Anzahl USB 2.0 AnschlĂĽsse: 1
Anzahl Ethernet-LAN-AnschlĂĽsse (RJ-45): 2
Stromversorgung: 550 W
Intel® Wireless-Display (Intel® WiDi): Nein
Grafikkarte: G200eH2
Prozessor-Taktfrequenz: 1.9 GHz
Prozessorfamilie: Intel® Xeon® E5 v3
Prozessor: E5-2609V3
Speicherkapazität: 8 GB
USB 3.2 Gen 1 (3.1 Gen 1) Anzahl der AnschlĂĽsse vom Typ A: 2
Gehäusetyp: Rack (2U)
Prozessor-Cache: 15 MB
Konfliktloser-Prozessor: Nein
Frontsidebus des Prozessors: - MHz
Prozessor Cache Typ: Smart Cache
Prozessor Codename: Haswell
Prozessor Lithografie: 22 nm
Prozessorbetriebsmodi: 64-Bit
Prozessor-Paketgröße: 52.5 x 45 mm
Prozessor-Threads: 6
Stepping: M1
Systembus-Rate: 6.4 GT/s
Thermal Design Power (TDP): 85 W
Prozessor-Serien: Intel Xeon E5-2600 v3
Intel® Virtualisierungstechnik (Intel® VT): VT-d, VT-x
Prozessorsockel: LGA 2011-v3
ARK Prozessorerkennung: 81897
Interner Speichertyp: DDR4-SDRAM
Intel® Turbo-Boost-Technologie: Nein
Eingebettete Optionen verfĂĽgbar: Ja
Intel® 64: Ja
Intel® Virtualization Technologie (VT-X): Ja
Anzahl VGA (D-Sub) AnschlĂĽsse: 1
Motherboard Chipsatz: Intel C610
RAM-Speicher maximal: 128 GB
Ethernet Schnittstellen Typ: Gigabit Ethernet
HDD Größe: - "
Gesamtspeicherkapazität: 0 GB
Intel® Hyper-Threading-Technik (Intel® HT Technology): Nein
Intel® Identity-Protection-Technologie (Intel® IPT): Nein
Verbesserte Intel SpeedStep Technologie: Ja
Anzahl installierter Prozessoren: 1
PCI-Express-Slots-Version: 3.0
PCI Express Konfigurationen: x4, x8, x16
Maximale Anzahl der PCI-Express-Lanes: 40
Maximaler interner Speicher, vom Prozessor unterstĂĽtzt: 768 GB
Speichertypen, vom Prozessor unterstĂĽtzt: DDR4-SDRAM
Speichertaktraten, vom Prozessor unterstĂĽtzt: 1600,1866,2133 MHz
Durch den Prozessor (max) unterstĂĽtzte Speicherbandbreite: 51 GB/s
Speichertaktfrequenz: 2133 MHz
Speicherkartensteckplätze: 8x DIMM
Speicherlayout: 1 x 8 GB
Optisches Laufwerk - Typ: Nein
Unterstützte Befehlssätze: AVX 2.0
Intel® Quick-Sync-Video-Technik: Nein
Intel® InTru™ 3D Technologie: Nein
Intel® Clear Video HD Technology für (Intel® CVT HD): Nein
Intel® AES New Instructions (Intel® AES-NI): Ja
Execute Disable Bit: Ja
Leerlauf Zustände: Ja
Thermal-Ăśberwachungstechnologien: Ja
Intel® Trusted-Execution-Technik: Ja
Skalierbarkeit: 2S
CPU Konfiguration (max): 2
Intel® VT-x mit Extended Page Tables (EPT): Ja
Intel® TSX-NI: Nein
Intel® Sicherer Schlüssel: Ja
Intel® OS Guard: Ja
Intel® Virtualisierungstechnik für direkte I/O (VT-d): Ja
Intel® Clear Video Technologie: Nein
Grafikkarte-Familie: Matrox
Bus Typ: QPI
Speicherkanäle, vom Prozessor unterstützt: Quad
ECC vom Prozessor unterstĂĽtzt: Ja
FSB Gleichwertigkeit: Nein
Intel® My-WiFi-Technik (Intel® MWT): Nein
Intel® Anti-Theft Technologie (Intel® AT): Nein
Intel® Insider™: Nein
Intel® Flex Memory Access: Nein
Intel® Smart Cache: Ja
Intel® Enhanced Halt State: Ja
Intel® Demand Based Switching: Ja
Intel® Clear Video Technology für Mobile Internet Devices (Intel® CVT for MID): Nein
Intel® Identity Protection Technologieversion: 0.00
Intel® Secure Key Technologieversion: 1.00
Intel® TSX-NI-Version: 0.00
Intel® Dual Display Capable Technology: Nein
Intel® FDI-Technik: Nein
Intel® Rapid-Storage-Technik: Nein
Intel® Fast Memory Access: Nein
Tcase: 70.9 °C
Physical Address Extension (PAE): Ja
Anzahl der Haupt-Netzteile: 1
Anzahl der QPI links: 2
Max. Speicherkapazität: - TB
Ungenutzter LĂĽfter-Support: Ja
Ethernet/LAN: Ja

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