Supermicro X9DBL-i Bedienungsanleitung

Supermicro Hauptplatine X9DBL-i

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USER’S MANUAL

Revision 1.0c

X9DBL-3

X9DBL-3F

X9DBL-i

X9DBL-iF

Manual Revision 1.0c

Release Date: May 23, 2013

Unless you request and receive written permission from Super Micro Computer, Inc., you may not

copy any part of this document.

Information in this document is subject to change without notice. Other products and companies

referred to herein are trademarks or registered trademarks of their respective companies or mark

holders.

Printed in the United States of America

The information in this User’s Manual has been carefully reviewed and is believed to be accurate.

The vendor assumes no responsibility for any inaccuracies that may be contained in this document,

and makes no commitment to update or to keep current the information in this manual, or to notify

any person or organization of the updates. Please Note: For the most up-to-date version of this

manual, please see our Website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product

described in this manual at any time and without notice. This product, including software and docu-

mentation, is the property of Supermicro and/or its licensors, and is supplied only under a license.

Any use or reproduction of this product is not allowed, except as expressly permitted by the terms

of said license.

IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT,

SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE

USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF

THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC.

SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED

WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,

INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between the manufacturer and the customer shall be governed by the laws of

Santa Clara County in the State of California, USA. The State of California, County of Santa Clara

shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for

all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class

A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference when the equipment is operated in a commercial

environment. This equipment generates, uses, and can radiate radio frequency energy and, if not

installed and used in accordance with the manufacturer’s instruction manual, may cause harmful

interference with radio communications. Operation of this equipment in a residential area is likely

to cause harmful interference, in which case you will be required to correct the interference at your

own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate

warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate

Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this

product may expose you to lead, a chemical known to

the State of California to cause birth defects and other

reproductive harm.

X9DBL-i/3/iF/3F Motherboard User’s Manual

Preface

This manual is written for system integrators, PC technicians and

knowledgeable PC users. It provides information for the installation and use of the

X9DBL-i/3/iF/3F motherboard.

About This Motherboard

The Super X9DBL-i/3/iF/3F motherboard supports dual Intel E5-2400 Series

(Socket B2) processors and Intel QPI (QuickPath Interface) Technology (V.1.1),

providing point-to-point connections with transfer speeds of up to 8.0 TG/s. With

the C606/C602 chipset built in, the X9DBL-i/3/iF/3F motherboard supports Intel®

Manageability Engine (ME), Rapid Storage Technology, Digital Media Interface

(DMI), PCI-E Gen. 3.0, and DDR3 memory of up to 1600 MHz. These features

greatly enhance system performance. This motherboard is ideal for high-end server

platforms. Please refer to our Website at http://www.supermicro.com for processor

and memory support.

Manual Organization

Chapter 1 describes the features, speciﬁ cations and performance of the mother-

board. It also provides detailed information on the Intel C606/C602 chipset.

Chapter 2 provides hardware installation instructions. Read this chapter when in-

stalling the processor, memory modules, and other hardware components into the

system. If you encounter any problems, see , which describes trouble-Chapter 3

shooting procedures for video, memory, and system setup stored in the CMOS.

Chapter 4 includes an introduction to the BIOS, and provides detailed information

on running the CMOS Setup utility.

Appendix A provides BIOS Error Beep Codes.

Appendix B lists software installation instructions.

Preface

iii

Produktspezifikationen

Marke:	Supermicro
Kategorie:	Hauptplatine
Modell:	X9DBL-i
Prozessorhersteller:	Intel
WLAN:	Nein
Breite:	304.8 mm
Tiefe:	254 mm
Anzahl USB 2.0 Anschlüsse:	7
Betriebstemperatur:	10 - 35 °C
Relative Luftfeuchtigkeit in Betrieb:	8 - 90 %
Eingebauter Ethernet-Anschluss:	Ja
Anzahl Ethernet-LAN-Anschlüsse (RJ-45):	2
Temperaturbereich bei Lagerung:	-40 - 70 °C
Luftfeuchtigkeit bei Lagerung:	5 - 95 %
RAID Level:	0, 1,5, 10
Prozessorsockel:	LGA 1356 (Socket B2)
Anzahl VGA (D-Sub) Anschlüsse:	1
Motherboard Chipsatz:	Intel® C602
Komponente für:	Server
Unterstützte Arbeitsspeicher:	DDR3-SDRAM
ECC:	Ja
Ohne ECC:	Ja
Unterstützte Arbeitsspeichergeschwindigkeit:	800,1066,1333,1600 MHz
RAM-Speicher maximal:	384 GB
Unterstützte Speicherlaufwerk-Schnittstellen:	SATA II, SATA III
PCI-Express x16 (Gen 3.x)-Anschlüsse:	1
SATA III Anschlüsse:	2
BIOS-Speichergröße:	64 Mbit
BIOS-Typ:	AMI
ACPI-Version:	4.0
Ethernet Schnittstellen Typ:	10 Gigabit Ethernet, Fast Ethernet
LAN-Controller:	Intel® 82574L
Anzahl serielle Anschlüsse:	2
SATA II Anschlüsse:	4
PCI-Express x1-Slots:	1
Speicherspannung:	1.35, 1.5 V
PCI-Express x4 (Gen 3.x)-Anschlüsse:	1
Zahl der DIMM Slots:	6
PCI-Express x8 (Gen 3.x)-Anschlüsse:	3
Intel® Xeon-Serie:	E5-2400
Unterstützte DIMM-Modulkapazitäten:	16GB, 1GB, 2GB, 32GB, 4GB, 8GB
Unterstützte QPI:	8 GT/s