Supermicro X7DVL-3 Bedienungsanleitung


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X7DVL-3
USER’S MANUAL
Revision 1.1b
X7DVL-i
The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this
manual, please see our web site at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software, if any,
and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or
reduced to any medium or machine without prior written consent.
IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT,
SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE
USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC.
SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED
WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall
be the exclusive venue for the resolution of any such disputes. SuperMicro's total liability for
all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”
WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.
Unless you request and receive written permission from Super Micro Computer, Inc. , you may not
copy any part of this document.
Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.
Copyright © 2008 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
Manual Revision 1.1b
Release Date: November 4, 2008
Preface
About This Manual
This manual is written for system integrators, PC technicians and
knowledgeable PC users. It provides information for the installation and use of
the X7DVL-3/X7DVL-i motherboard. The X7DVL-3/X7DVL-i
supports dual Intel Xeon Quad Core/Dual Core processors (w/771 LGA) with a
front side bus speed of 667 MHz/1.066 GHz/1.333 GHz. With dual 64-bit Xeon
Quad Core/Dual Core processors built-in, the X7DVL-3/X7DVL-i offers substantial
functionality enhancements to the motherboards based on the Intel Core NetBurst
microarchitecture while remaining compatible with the IA-32 software. The fea-
tures include Intel Hyper-Threading Technology, Virtualization Technology, Hyper
Pipelined Technology, Execution Trace Cache, Thermal Monitor 1/2 (TM1/TM2),
Enhanced Intel SpeedStep technology, Advanced Dynamic Execution, Advanced
Transfer Cache, Streaming SIMD Extensions 3 (SSE3) and Extended Memory 64
Technology (EM64T). These features allow the motherboard to operate at much
higher speeds with better power management in much safer thermal environments
than the traditional motherboards. The X7DVL-3/X7DVL-i is ideal for high perfor-
mance dual processor (DP) and enterprise server environments. Please refer to
the motherboard speci cations pages on our web site (http://www.supermicro.
com/products/motherboard/) for updates on supported processors. This product is
intended to be professionally installed.
Manual Organization
Chapter 1 describes the features, speci cations and performance of the mainboard
and provides detailed information about the chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when
installing the processor, memory modules and other hardware components into
the system. If you encounter any problems, see , which describes Chapter 3
troubleshooting procedures for the video, the memory and the system setup stored
in the CMOS.
Chapter 4 includes an introduction to BIOS and provides detailed information on
running the CMOS Setup utility.
Appendix A provides BIOS POST Error Codes. andAppendix B Appendix C list
the Windows OS Installation and Other Software Installation Instructions.
Conventions Used in the Manual:
Special attention should be given to the following symbols for proper installation and
to prevent damage done to the components or injury to yourself:
Danger/Caution: Instructions to be strictly followed to prevent catastrophic
system failure or to avoid bodily injury.
Warning: Important information given to ensure proper system installation or
to prevent damage to the components.
Note: Additional Information given to differentiate various models or to ensure cor-
rect system setup.
iii
Preface


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Marke: Supermicro
Kategorie: Hauptplatine
Modell: X7DVL-3

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