Supermicro MBD-H8DMU+-B Bedienungsanleitung
Supermicro
Hauptplatine
MBD-H8DMU+-B
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H8DMU+
USER’S MANUAL
Revision 1.1a
SUPER
Manual Revision 1.1a
Release Date: July 22, 2009
The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this
manual, please see our web site at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software, if any,
and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or
reduced to any medium or machine without prior written consent.
IN NO EVENT WILL SUPERMICRO BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO
USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. IN PARTICULAR, SUPERMICRO SHALL NOT HAVE LIABILITY FOR ANY
HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE
COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH
HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall
be the exclusive venue for the resolution of any such disputes. Super Micro's total liability for
all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”
WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.
Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.
Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.
Copyright © 2009 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
Preface
iii
Preface
About This Manual
This manual is written for system integrators, PC technicians and
knowledgeable PC users. It provides information for the installation and use of the
H8DMU+ serverboard. The H8DMU+ is based on the nVidia® MCP55 Pro chipset
and supports single or dual AMD Opteron 2000 Series Socket F type processors
and up to 64 GB of DDR2-800/667/533 registered ECC SDRAM.
Please refer to the serverboard specifi cations pages on our web site for updates
on supported memory and processors (http://www.supermicro.com/aplus/). This
product is intended to be professionally installed.
Manual Organization
Chapter 1 includes a checklist of what should be included in your serverboard
box, describes the features, specifi cations and performance of the serverboard and
provides detailed information about the chipset.
Chapter 2 begins with instructions on handling static-sensitive devices. Read this
chapter when installing the processor(s) and memory modules and when installing
the serverboard in a chassis. Also refer to this chapter to connect the fl oppy and
hard disk drives, the parallel and serial ports, the mouse and keyboard and the
twisted wires for the power and reset buttons and the system LEDs.
If you encounter any problems, see Chapter 3, which describes troubleshooting
procedures for the video, the memory and the setup confi guration stored in CMOS.
For quick reference, a general FAQ (Frequently Asked Questions) section is pro-
vided. Instructions are also included for contacting technical support. In addition,
you can visit our web site for more detailed information.
Chapter 4 includes an introduction to BIOS and provides detailed information on
running the CMOS Setup utility.
Appendix A provides BIOS Error Beep Code Messages.
Appendix B lists BIOS POST Checkpoint Codes.
Produktspezifikationen
Marke: | Supermicro |
Kategorie: | Hauptplatine |
Modell: | MBD-H8DMU+-B |
Breite: | 307 mm |
Tiefe: | 332 mm |
Anzahl USB 2.0 Anschlüsse: | 2 |
Betriebstemperatur: | 10 - 35 °C |
Relative Luftfeuchtigkeit in Betrieb: | 8 - 90 % |
Zertifizierung: | RoHS 5/6 |
Anzahl Ethernet-LAN-Anschlüsse (RJ-45): | 2 |
Temperaturbereich bei Lagerung: | -40 - 70 °C |
Luftfeuchtigkeit bei Lagerung: | 5 - 95 % |
Prozessorsockel: | Socket F (1207) |
Anzahl VGA (D-Sub) Anschlüsse: | 1 |
Speicherkanäle: | Zweikanalig |
ECC: | Ja |
Unterstützte Arbeitsspeichergeschwindigkeit: | 533,667,800 MHz |
Anzahl PS/2 Anschlüsse: | 2 |
Anzahl USB 2.0 Schnittstellen: | 4 |
Zahl der Chassisventilatorstecker: | 8 |
Chassis Intrusion Stecker: | Ja |
BIOS-Speichergröße: | 64 Mbit |
BIOS-Typ: | AMI |
ACPI-Version: | 2.0 |
Ethernet Schnittstellen Typ: | Gigabit Ethernet |
Anzahl serielle Anschlüsse: | 1 |
Eingebaute Grafikadapter: | Ja |
Speicherspannung: | 1.8 V |
PCI-Express x4-Slots: | 1 |
PCI-Express x8-Slots: | 5 |
Zahl der DIMM Slots: | 16 |
Maximaler RDIMM Speicher: | 128 GB |
Unterstützte DIMM-Modulkapazitäten: | 1GB, 256MB, 2GB, 4GB, 512MB |
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