Dell PowerEdge M610 Bedienungsanleitung

Dell Server PowerEdge M610

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PowerEdge M610

Technical Guide

The Dell PowerEdge

M610 blade server

helps cut operating

expenses through

energy efficiency,

product flexibility,

and efficient use of

data center space.

Dell

Dell PowerEdge M610 Technical Guide ii

Dell, PowerEdge, EqualLogic, PowerVault, OpenManage, and ReadyRails are trademarks of Dell, Inc.

Citrix and XenServer are trademarks of Citrix Systems, Inc. and/or one or more of its subsidiaries,

and may be registered in the United States Patent and Trademark Office and in other countries.

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Revision 2 July 2 201

Dell

Dell PowerEdge M610 Technical Guide iii

Table of Contents

1 Product Comparison ........................................................................................... 1

1.1 Overview .................................................................................................. 1

1.1.1 Strong IT Foundation 1 ...............................................................................

1.1.2 Purposeful Design .................................................................................. 1

1.1.3 Scalability for Growth ............................................................................. 1

1.1.4 Smart Investment 1 ..................................................................................

1.1.5 Simplified Systems Management ................................................................. 2

1.1.6 Lifecycle Controller ................................................................................ 2

1.2 Product Comparison 2 .....................................................................................

2 New Technologies .............................................................................................. 5

2.1 Overvi ew .................................................................................................. 5

3 System Information ............................................................................................ 6

4 Mechanical ...................................................................................................... 8

4.1 Chassis Description 8 .......................................................................................

4.2 Dimensions and Weight .................................................................................. 8

4.3 Internal Module View .................................................................................... 9

4.4 Cover Latch ............................................................................................... 9

4.5 Security .................................................................................................... 9

4.5.1 TPM (Trusted Platform Module) .................................................................. 9

4.5.2 Power Off Security ................................................................................. 9

4.6 USB Key .................................................................................................. 10

4.7 Battery ................................................................................................... 10

4.8 Field Replaceable Units (FRU) ........................................................................ 10

4.9 User Accessible Jumpers, Sockets, and Connectors ............................................... 10

5 Power, Thermal, Acoustic .................................................................................. 11

5.1 Power Supplies ......................................................................................... 11

5.2 Power Efficiency ....................................................................................... 11

5.3 Thermal Operating and Storage Specifications .................................................... 11

5.4 Acoustics ................................................................................................ 12

6 Processors ..................................................................................................... 14

6.1 Overview ................................................................................................ 14

6.2 Features ................................................................................................. 14

6.3 Supported Processors .................................................................................. 16

6.4 Processor Installation .................................................................................. 17

7 Memory ........................................................................................................ 18

7.1 Overview ................................................................................................ 18

7.2 DIMMs Supported ....................................................................................... 18

7.3 Memory Features ....................................................................................... 19

7.4 Memory Speed Limitations ............................................................................ 19

8 Chipset ........................................................................................................ 21

8.1 Overview ................................................................................................ 21

8.2 I/O Hub (IOH) ........................................................................................... 21

8.2.1 QuickPath Interconnect (QPI) .................................................................. 21

8.2.2 IOH PCI Express ................................................................................... 21

8.2.3 Direct Media Interface (DMI) ................................................................... 21

8.3 I/O Controller Hub 9 (ICH9) .......................................................................... 21

9 BIOS ............................................................................................................ 23

9.1 Overview ................................................................................................ 23

Produktspezifikationen

Marke:	Dell
Kategorie:	Server
Modell:	PowerEdge M610
Prozessorhersteller:	Intel
Anzahl Prozessorkerne:	4
Breite:	50 mm
Tiefe:	486 mm
Gewicht:	5200 g
Höhe:	189 mm
Anzahl USB 2.0 Anschlüsse:	2
Eingebauter Ethernet-Anschluss:	Ja
Mac-Kompatibilität:	Nein
Intel® Wireless-Display (Intel® WiDi):	Nein
Grafikkarte:	G200
Prozessor-Taktfrequenz:	2.66 GHz
Prozessorfamilie:	Intel® Xeon® 5000er-Prozessoren
Prozessor:	E5640
Kompatible Betriebssysteme:	Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V)\nWindows Server 2008 R2 SP1, x64 (includes Hyper-V v2)\nWindows HPC Server 2008\nNovell SUSE Linux Enterprise Server\nRed Hat Enterprise Linux\nOracle Solaris
RAID-Unterstützung:	Ja
RAM-Speicher:	6 GB
Gehäusetyp:	Blade
Prozessor-Cache:	12 MB
Prozessor Boost-Frequenz:	2.93 GHz
Konfliktloser-Prozessor:	Nein
Frontsidebus des Prozessors:	- MHz
Prozessor Cache Typ:	Smart Cache
Prozessor Codename:	Westmere EP
Prozessor Lithografie:	32 nm
Prozessorbetriebsmodi:	64-Bit
Prozessor-Paketgröße:	42.5 X 45 mm
Prozessor-Threads:	8
Stepping:	B1
Systembus-Rate:	5.86 GT/s
Thermal Design Power (TDP):	80 W
Prozessor-Serien:	Intel Xeon 5600 Series
Prozessorsockel:	Socket B (LGA 1366)
ARK Prozessorerkennung:	47923
Interner Speichertyp:	DDR3-SDRAM
Intel® Turbo-Boost-Technologie:	1.0
Eingebettete Optionen verfügbar:	Nein
Intel® 64:	Ja
Intel® Virtualization Technologie (VT-X):	Ja
Kompatible Prozessoren:	Intel® Xeon®
Motherboard Chipsatz:	Intel® 5520
ECC:	Ja
RAM-Speicher maximal:	192 GB
HDD Kapazität:	146 GB
HDD Geschwindigkeit:	15000 RPM
HDD Größe:	2.5 Zoll
Gesamtspeicherkapazität:	146 GB
Intel® Hyper-Threading-Technik (Intel® HT Technology):	Ja
Verbesserte Intel SpeedStep Technologie:	Ja
Anzahl installierter Prozessoren:	1
Maximaler interner Speicher, vom Prozessor unterstützt:	288 GB
Speichertypen, vom Prozessor unterstützt:	DDR3-SDRAM
Speichertaktraten, vom Prozessor unterstützt:	800,1066 MHz
Durch den Prozessor (max) unterstützte Speicherbandbreite:	25.6 GB/s
Speichertaktfrequenz:	1333 MHz
Speicherkartensteckplätze:	12x DIMM
Speicherlayout:	3 x 2 GB
Anzahl der installierten HDDs:	1
Unterstützte Befehlssätze:	SSE4.2
Intel® Quick-Sync-Video-Technik:	Nein
Intel® InTru™ 3D Technologie:	Nein
Intel® Clear Video HD Technology für (Intel® CVT HD):	Nein
Intel® AES New Instructions (Intel® AES-NI):	Ja
Execute Disable Bit:	Ja
Leerlauf Zustände:	Ja
Thermal-Überwachungstechnologien:	Nein
Intel® Trusted-Execution-Technik:	Ja
CPU Konfiguration (max):	2
Intel® VT-x mit Extended Page Tables (EPT):	Ja
Intel® Virtualisierungstechnik für direkte I/O (VT-d):	Ja
Intel® Clear Video Technologie:	Nein
Grafikkarte-Familie:	Matrox
Bus Typ:	QPI
Speicherkanäle, vom Prozessor unterstützt:	Triple
ECC vom Prozessor unterstützt:	Ja
FSB Gleichwertigkeit:	Nein
HDD Schnittstelle:	Serial Attached SCSI (SAS)
Intel® My-WiFi-Technik (Intel® MWT):	Nein
Intel® Anti-Theft Technologie (Intel® AT):	Nein
Intel® Insider™:	Nein
Intel® Flex Memory Access:	Nein
Intel® Enhanced Halt State:	Ja
Intel® Demand Based Switching:	Ja
Intel® Clear Video Technology für Mobile Internet Devices (Intel® CVT for MID):	Nein
Intel® Dual Display Capable Technology:	Nein
Intel® FDI-Technik:	Nein
Intel® Rapid-Storage-Technik:	Nein
Intel® Fast Memory Access:	Nein
CPU-Multiplikator (Bus-/Kernverhältnis):	20
Konformität mit Industriestandards:	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Tcase:	77.6 °C
Netzwerkfunktionen:	Gigabit Ethernet
Maximale unterstützte Anzahl der HDD:	2
Physical Address Extension (PAE):	40 Bit
Hot-Swap:	Ja
Anzahl der QPI links:	2
Max. Speicherkapazität:	1.2 TB
Disk Array Controller:	SAS 6/iR